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全球首颗3D封装芯片诞生
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全球首颗3D封装芯片诞生
全球首颗3D封装芯片诞生
2024-05-17
The world's first 3D packaging chip was born (3d packaging technology chip)
1, 3D packaging advantages of 3D packaging technology 2, Advanced packaging strong rise, affecting the IC industry patt...
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Chip Product
HSMS-8202-TR1G Original imported spot inventory
LTC6373IDFM#TRPBF Original imported spot inventory
MAX96789GTN/V+T Original imported spot inventory
AD8630ARZ-REEL7 Original imported spot inventory
