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1, What is the passivation layer underneath the silicon in the middle of the chip 2, Chip passivation layer is general...
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The process principle of electric injection is that it is necessary to use electric injection equip...
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The BTA06-600B8 is a tripolar bidirectional thyristor with the following parameters: rated current 600A, rated voltage 6...
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In microelectronics, silicon dioxide thin films are widely used for their superior electrical insulation and process fe...
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BT151 Unidirectional thyristor (TO-220 features advanced glass passivation chip with sensitive control pole trigger cur...
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You can consider using the surge current test and HTRB HTIR test the current resistance size in addition to the size of...
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IGBT packaging process generally includes the following steps:1. Wafer cutting: The wafer is cut into a single chip, usu...
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Generally use wire cutting or CNC machine tools.Silicon nitride ceramic is a kind of inorganic material ceramic which do...
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VOCs sources are complex, involving many industries, large quantities and wide areas, including petrochemical, chemical,...
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Some scenarios will directly use bare chips, such as COB, or RF microwave high-speed chips and so on. Generally, the out...
