-
Simply put, BGA is a chip packaging method that realizes the adhesion and conduction of integrated circuit...
-
Ordinary lead-free solder, melting point 210-230 degrees, working temperature 245-280 degrees, lead solder according to...
-
1. Do not charge nitrogen. 2. In the bga reflow welding process, the welding area needs to be heated at high temperature...
-
No welding required. 1. BGA is a surface mount technology, which is usually used to connect chips and PCB boards. Howev...
-
1, the memory may be loose or the memory itself has a problem, reinsert the memory or change the root memory to try.2. T...
-
The DSP chip packaged by GBA is best used more than four layers. Here's why.First, the density of IC and PCB welding of...
-
Common BGA welding phenomena are described as follows.(1 Blow holes: holes or circular pits appear on the surface of th...
-
It is necessary to make balls before bga welding. It refers to a welding method in which the solder and the solder are h...
-
1. Preparation for repair: For the BGA chip to be repaired, determine the air nozzle nozzle to be used.2, set the weldin...
-
BGA tin ball A special solder ball used on a tin plate before soldering BGA encapsulated integrated circuits. The specif...
