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The polyimide (pi layer is usually set in the traditional chip packaging components to protect the line and buffer the...
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Chip design and packaging, from the production point of view, belongs to the product upstream and downstream relationshi...
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There are many kinds of package names, such as LQFP, SOP, SOT, DIP, etc....
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As far as I know, the status of packaging in the chip industry is a very important link, without this link, the chip can...
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The CPU chip packaging and testing process is described as follows: Preparing for chip packaging: Prepare chip drawings...
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Chip glue packaging refers to the use of glue to fix the chip on the substrate to form a stable package structure. The g...
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Packaging is the back-end process of integrated circuit manufacturing, integrated circuit packaging is the process of fu...
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In addition to the DIP dual in-line package, there are:DIP-tab dual in-line package with heat sinkPDIP plastic dual in-l...
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Wafer-level Chip Scale Packaging Technology (WLCSP 晶圆级芯片规模封装技术WLCSP (Wafer Level Chip Scale Packaging is a wafer-level...
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The Chinese translation of packaging industry in China is very mixed. The speculation is about the Wire bond(WB package...
