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The packaging work of Huawei's 5G chips is usually undertaken by professional packaging manufacturers, such as Taiwan Se...
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UBM is an advanced packaging process that requires the establishment of a thin film metal layer stack between an integra...
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Packaging is the process of assembling the integrated circuit into the final product of the chip, simply put, is to put...
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There are many kinds of this, for example, the cheaper leadframe, you can directly link the pad on the chip to the leadf...
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SOP Package (Small Outline Package and Chip Carrier package (Chip Carrier Package are two common forms of integrated c...
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Mobile phone chip package mainly has the following types: 1. BGA package (ball grid array package : common in high-perf...
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1. The packaging process can generally be divided into two parts, the process step before the plastic packaging becomes...
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so-8 is packaged in vinyl.The packaging process is as follows:The first step: crystal expansion. The expansion machine i...
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The chip package DIP and SOP have the following differences: 1. DIP and SOP are the two common packaging forms of chips....
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Semiconductor packaging refers to the process of processing individual chips from tested wafers according to product mod...
