The birth process of the chip includes three main stages: design, manufacturing and testing. First, the designer develops the function and structure of the chip according to the requirements and specifications, and uses computer-aided design software for circuit design and layout.
Manufacturing engineers then turn the design into an actual chip prototype, making the circuit on the silicon wafer through process steps such as photolithography, thin film deposition, and ion implantation.
Finally, the chip is subjected to rigorous testing and quality control to ensure its performance and reliability. The whole process requires a high degree of technical and equipment support, as well as strict quality management.
The birth process of the chip has gone through three key stages: design, manufacturing and testing.
First of all, according to the requirements and functional requirements, the designer uses EDA software to design the chip circuit diagram.
Manufacturing engineers then turn the circuit diagram into a photostereotype and use photolithography to form a circuit pattern on the silicon wafer.
Then, the circuit structure is formed through chemical corrosion, deposition, etching and other process steps, and finally the test engineer tests the function, reliability and performance of the chip to ensure that the chip meets the requirements.