1, semiconductor WB, refers to wire bonding. The thin metal wire or metal strip is sequentially laid on the welding pad of the chip and the pin frame or the package substrate to form a circuit interconnection. Wire bonding techniques include ultrasonic bonding, hot pressing bonding and thermosonographyWave bonding. Automatic Carrier bonding (TAB) : Technical process for connecting the chip bonding area to the metal wiring bonding area on the I/O or substrate of the electronic package housing with a metal foil wire with lead pattern.
2, esinc technology is a three-dimensional wafer-level packaging technology. eSinC technology uses high-precision silicon etched to form a cavity to embed different chips or devices into silicon wafers. The chips are interconnected through high-density rewiring, and vertical interconnection is achieved by making a via last TSV on a fan-out silicon chip. The chip can be realized by C2W or W2W through micro-convex/bonding adhesive hybrid bondingThree-dimensional stack.
3, Wire Bond Process Engineering (wire bond process engineering) - to provide customers with technical solutions for various customer specific applications. - Develop and optimize the lead bonding process. - Quality assurance of capillaries existing and new equipment, both gold and silver wire. Solder Ball Attach Technology - Solder ball attach technology is a process that uses a solder material to attach the solder ball to the PCB ball pad.
4, refers to the electricitySub-factory, keyboard consolidation work. Bonding is the use of gold, copper or aluminum wire to connect the electrode lead on the surface of the semiconductor device chip to the base or lead frame of the lead.
5, semiconductor. According to the query of aluminum wire bonding related information, aluminum wire bonding belongs to the semiconductor package type. The invention relates to a novel aluminum wire bonding and pressing device, belonging to the technical field of semiconductor packaging.
Wire BondingMachine) : It is used to connect the chip to the bracket, which is connected through a fine metal wire. This is a common encapsulation method. Encapsulation Equipment: Used to encapsulate chips and connection wires in one or more layers of packaging material to provide protection and mechanical support. The packaging material is usually resin or plastic.
Welding equipment: Used to attach semiconductor chips to package substrates or lead frames. Common welding techniques include Wire Bonding (Wire Bonding), ball bonding (Flip Chi)p Bonding, Die Attach and so on. Gluing device: Used to attach semiconductor chips to package substrates to provide mechanical support and fixation. Gluing equipment uses glue or adhesive to bond the chip to the substrate.
Common semiconductor packaging devices include: Chip sorters: used to separate chips from wafers. Pad preparation equipment: a pad for preparing chip connections, including a spherical pad preparation equipment and a flat pad preparation equipment. Welding equipment: used to connect the chip to the pad, including welding wire bonding equipment and welding ball bonding equipment.
Semiconductor packaging equipment includes printing presses, solidifying machines, reflow soldering, light inspection, rework, molding and cutting. Among them, the solidification machine is the key process in the packaging process, it is recommended that the pixel solidification machine of Zhuo Xing Semiconductor, the use of new solidification technology - pixel solidification technology, reduce the solidification path, improve the solidification speed at the same time, the solidification yield and accuracy are also guaranteed, and the through yield is greater than 9999%.
Semiconductor package test equipment is a device used to test and package semiconductor chips,Test Handler: Used to test and classify chips, usually including components such as test heads, probe cards, and robotic arms. Wire Bonder (Wire Bonder) : Used to connect the chip to the pin of the package device, usually using gold or copper wire for connection.
Photolithography Equipment: used to define and manufacture tiny circuit patterns on a chip, usually used in the initial stages of manufacturing a chip. Cleaning equipment (Cleaning Equipment) : Used to clean and purify the chip surface, ensuring good welding and packaging quality. Package Testing Equipment: Used to test the reliability, performance and quality of the packaged chip.
Welding machine: The welding machine is used to attach the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding. Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. This device can simulate the stress and temperature environment in real use. refrigerationMachine: The refrigeration machine is used to cool the chip so that more accurate results can be obtained when testing.
Common semiconductor packaging devices include: Chip sorters: used to separate chips from wafers. Pad preparation equipment: a pad for preparing chip connections, including a spherical pad preparation equipment and a flat pad preparation equipment. Welding equipment: used to connect the chip to the pad, including welding wire bonding equipment and welding ball bonding equipment.
The main semiconductor packaging and testing equipment includes: thinning machine. Thinning machine is to thin the wafer substrate by thinning/grinding to improve the heat dissipation of the chipEffect, thinning to a certain thickness is conducive to the later packaging process. Four probes.
What is Semiconductor packaging? The packaging of semiconductor electronic components not only acts as a bonding point for connecting internal integrated circuit chipsThe role of the external electrical assembly also provides a stable and reliable working environment for the integrated circuit, and plays a mechanical or environmental protection role for the integrated circuit chip. Therefore, the integrated circuit package should have strong mechanical properties, good electrical properties, heat dissipation properties and chemical stability.
SOP is the abbreviation of English Small Outline Package, that is, small outline package. SOP packaging technology was successfully developed by Phillip Company in 1968 ~ 1969, and gradually derived SOJ (J-type pin small shape package), TSOP (Thin small shape package), and TSOP (Thin small shape package).VSOP (Very small profile package), SSOP (reduced SOP), TSSOP (thin reduced SOP), SOT (small profile transistor), SOIC (small profile integrated circuit) and so on.
Semiconductor packaging refers to the process of processing the wafers that have passed the test into independent chips according to the product model and functional requirements. The main semiconductor packaging and testing equipment includes: thinning machine. Thinning machine is to thin the wafer substrate by thinning/grinding, improve the chip heat dissipation effect, thinning to a certain thickness is conducive to the later packaging process. Four probes.
The so-called halfConductor packaging, the semiconductor production process consists of wafer fabrication, wafer testing, chip packaging and post-package testing. After the molding, a series of operations are performed, such as Post Mold Cure, slitting and forming, Plating and printing.
Packaging technology in the semiconductor manufacturing process: the secret of precision connection and protection The core process of the semiconductor industry, packaging technology is like the guardian of electronic components, it will fine fix, connect and protect the chip in a specific structure to ensure the stability and performance of its functionCan play. The packaging process consists of a series of complex steps, each of which is critical.
There are holes in the metallized hole (2) solder resistance into the hole (3) The solution of improper flux: (1) Strengthen the inspection and control before hot air smoothing, especially the control of drilling, chemical copper deposition and electroplating process (2) Strengthen the control of screen printing or curtain coating process quality. (3) Replace the flux.
Wire quality is poor, aluminum and copper wire more bad, gold wire quality is better. Strengthen the quality control of wire receiving, and sampling six times a day, and instant feedback supplier encountered bad. The adjustment of the wire machine is deviated, and the method is to strengthen the technical ability of the field personnel. The operator has mistakes, generally speaking, the operator has little impact, the solution is to strengthen the technician and operator level.
This adverse phenomenon belongs to poor tin penetration in wave soldering, and the poor tin penetration in wave soldering is naturally directly related to the process of wave soldering, and the welding parameters with poor tin penetration are re-optimized, such as wave height, temperature, and welding timeOr moving speed, etc.
In the semiconductor packaging process, there are five factors and individual solutions to the reasons for the overflow of the post-sealing glue: overflow caused by the gas equipment problems in the plant, and the solution needs to be changed from daily inspection to time inspection. The setting of the die machine causes overflow, the most common, and the stroke needs to be adjusted to solve it. Mold deviation, is also common, need to restructure the mold to solve. The quality problem of mould glue is usually solved by consulting with the supplier's quality control.
The small hole caused by the heating of the product may be that there is water and bubbles in the product, which are discharged after heating and softening. 2.
Cause: Some alloy solidified