China's domestic chips are currently able to reach the process level of 90 nm. In the key links of chip manufacturing, equipment and materials such as lithography machine, etching machine, wafer, photoresist occupy an important proportion. In particular, lithography equipment, at present, Shanghai microelectronics enterprises have been able to provide 90 nm level products. However, in the field of high-end KrF and ArF photoresist, the self-sufficiency rate of domestic products is almost zero, and it is heavily dependent on imports.
Huawei is currently capable of producing 3-nanometer chips. Huawei's chip manufacturing technology has reached the level of several nanometers, and it is developing 2 nanometer technology coresPieces. Huawei has strong competitiveness in areas such as mobile devices, cloud computing and artificial intelligence, thanks to its advanced technology and manufacturing capabilities in chip manufacturing. Huawei's self-developed Kirin chip has gained wide recognition in the smartphone market.
At present, the most advanced process chip that can be mass-produced in China is 14nm. In the fourth quarter of 2019, SMIC said that 14nm had been put into mass production. In 2021, the news came out that SMIC's 14nm yield reached 95%, which has been tied with TSMC (7nm has also been put into small production). In 2020, Hua Hong announcedIt is currently able to achieve a manufacturing accuracy of 22 nanometers. Before the technological breakthrough made by Shanghai Microelectronics Equipment Company, the main manufacturing capacity of China's domestic lithography machine stayed at the 90 nanometer level. The technological progress from 90 nm to 22 nm directly shows that China has achieved autonomy and control in the key core technologies of lithography.
nano. According to the inquiry industry network, the maximum resolution of the domestic lithography machine is 90 nm, and the wavelength is 193 nm. The most advanced model of domestic lithography machine is SSA60020 from Shanghai Microelectronics.
As the current global lightThe main developer of lithography technology, China's lithography machine development has been attracting attention. In the past, China's lithography machine can only reach 50 nm production accuracy, however, in recent years, seize the opportunity, vigorously develop technology, China's lithography machine successfully achieved 25 nm and 18 nm production accuracy, successfully pushed the industrial chain to a higher level. Today, the lithography machine breaks the production limit of 7 nanometers, which is the latest strategic commanding height of industrial competition.
nano. According to the Chinese People's Daily Online, China has successfully developed the first domestic 28-nanometer (nm) lithography machine in 2023, which is expected to be delivered by the end of the yearUse.
smee lithography machine 22 nm. lithography, also known as mask alignment and exposure machine, exposure system, lithography system, etc., is the core equipment for manufacturing chips. It uses a technique similar to photo printing to print fine graphics on a mask plate onto a silicon chip through light exposure. On November 29, 2018, the national major scientific research equipment development project "super resolution lithography equipment development" passed acceptance.
ChinaAt present, the domestic chip can reach the process level of 90 nm. In the key links of chip manufacturing, equipment and materials such as lithography machine, etching machine, wafer, photoresist occupy an important proportion. In particular, lithography equipment, at present, Shanghai microelectronics enterprises have been able to provide 90 nm level products. However, in the field of high-end KrF and ArF photoresist, the self-sufficiency rate of domestic products is almost zero, and it is heavily dependent on imports.
China's chip manufacturing technology is currently capable of reaching the 14nm level. In the face of the challenges of domestic chip development, in addition to the challenges of the external environment and the continued sanctions of the United States, limiting key technologies and technologiesThe acquisition of the industry, China's chip industry is still trying to enhance their own capabilities through labor-intensive ways. Although progress has been made, there is still a big gap compared with the international advanced level.
According to the current data show that China's chips can only reach 14 nanometers, but the United States can reach five nanometers in chip manufacturing, this quantitative advantage means that their development is more robust, but even so the United States does not want to let go of China, and even in some application and development has been restricting China. It can be seen that the gap between Chinese chips and foreign chips is far.
countryThe chip production level can only achieve 90 nanometers. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm. High-end KrF and ArF photoresist are almost dependent on imports, of which ArF photoresist is almost zero domestic. Therefore, China wants to produce highly localized chips, and at present 90 nm is a demarcation point.
The mass production of 14nm process has been able to meet 95% of domestic chip production, according to previous news, SMIC's 14nm capacity will reach 15 by the end of the yearK wafers/month, after which there will be no significant growth, the focus will shift to the next generation of processes - N1 and N2 generation FinFET processes.
Co-CEO Liang Mengsong stressed that the mass production yield of 14nm process has reached the industry standard, but there is still room for improvement compared with international first-class enterprises. Smic is working with domestic and international customers to advance more than a dozen advanced process projects, including 14nm and beyond, demonstrating significant progress in technology research and development.
News from Fast Technology: SMIC 12nm process has begun customer import. Relative to 14nm process, 12nm process power consumption reduced by 20%, performance improved by 10%. And with the joining of Dr. Jiang Shangyi and the overcoming of Dr. Liang Mengsong's team, SMIC's next-generation process research and development has also been steadily carried out, or will enter the 7nm process stage. In addition, Shanghai Huahong Group recently revealed that its 14nm FinFET process has also been fully completed, and the yield has reached 25%.