2, the advantages of three-dimensional integration are: ① improve the packaging density. Multilayer device overlap structure can increase chip integration twice. ② Improve the speed of the circuit. Overlapping structures shorten cell lines and enable parallel signal processing,Thus, the high-speed operation of the circuit is realized. ③ New multifunctional devices and circuit systems can be realized. For example, the functional devices such as photoelectric devices and silicon integrated circuits are integrated together to form a new functional system.
3, reduce the cost and package size, especially suitable for mobile applications. Their System on a Chip (SoIC) technology further improves system performance by reducing the form factor. In 5D and 3D packaging technology, CoWoS has three modes, namely COWOS-S, COWOS-R and COWOS-L, each with its specific application scenarios and advantages.
4, can have such a large improvement, is because the IPU uses 3D WoW silicon wafer stacking technology, so as to achieve a comprehensive improvement in performance and energy consumption ratio. As the world's first chip using TSMC 3D WoW technology, Bow IPU proves through this change that the improvement of chip performance does not necessarily need to improve the process, but can also upgrade the packaging technology and transfer to advanced packaging.
5, D/3D packaging technology such as Intel's EMIB and TSMC's CoWoS, then realize the revolutionary connection between die and die, through the wire carrier board orSi Interposers, such as Intel's EMIB, provide higher density and bandwidth through 10um and 2um pitch bump. 6, D package through the wafer-level interconnect technology to achieve high-density packaging between chips, can effectively meet the needs of high-function chips ultra-light, ultra-thin, high performance, low power consumption and low cost, is considered by most semiconductor manufacturers to be the most potential packaging method. In short, driven by market demand, more and more advanced packaging technologies have been developed, and the market share of advanced packaging will be further expanded.
2, affected by the physical limit and the huge rise in costs, the semiconductor industry has entered the "post-Moore era", and the industry has gradually shifted from the promotion of wafer manufacturing technology nodes in the past to the innovation of packaging technology. As an important part of the semiconductor core industry chain, advanced packaging technology can not only improve function and improve productionProduct value, but also effectively reduce costs, become an important path to continue Moore's Law.
3, no matter whether the above news is true, in the current difficult process progress, the importance of advanced packaging is more and more prominent, and TSMC, as a leading enterprise, its advanced process and packaging highly integrated ability will lead the chip packaging market in the next few years, the corresponding move will also have an impact on the market pattern.
4, in the field of advanced packaging, advanced packaging is still hot, a large amount of capital investment in advanced packaging, mainly RF, CIS, memory and other aspects of the rapid growth of sealing demand, the overall market is still toYes. However, traditional packaging may turn to oversupply, traditional packaging production capacity formation cycle is short, there has been a certain degree of loosening of production capacity, and the supply and demand situation may be reversed next year. On the other hand, the strength of sealing equipment material enterprises continues to increase.
5, while the scale continues to expand, China's integrated circuit industry from packaging and testing and manufacturing as the main body, into IC design, chip manufacturing, packaging and testing three industries and supporting the common development of the more complete industrial chain pattern, the proportion of the three industries is becoming reasonable, the overall supporting capacity is increasing. In 2000, China's IC design industry accounted for the total output value of the whole industryThe proportion is only 3%, and the proportion of packaging and testing industry is as high as 69%.
6, the future of advanced packaging: IPPS commitment and mission in the post-Moore era, chip manufacturing is facing the dual challenges of physical limits and economic efficiency. As Shenzhen Ipas New Material Technology Co., LTD., with deep accumulation in the field of BT substrates and laminates, IPPS actively invests in the research and development of advanced semiconductor packaging materials, and is committed to providing customers with more integrated and more efficient packaging solutions.
On October 3, Fast Technology learned that Damo Institute successfully developed a new architecture chip. The chip is the world's first DRAM-based 3D bonding stacked memory and computing integrated AI chip, which can break through the performance bottleneck of von Neumann architecture and meet the needs of high bandwidth, high capacity memory and extreme computing power in artificial intelligence and other scenarios. In specific AI scenarios, the chip performance is increased by more than 10 times, and the energy efficiency ratio is increased by up to 300 times.
fromSince the beginning of the digital computer era, the difficulty of separating processors from memory has been a bottleneck that has hindered high-performance computing, especially when dealing with neural network tasks. However, the breakthrough in simulation technology by the imec and GF industrial alliance has removed the von Neumann bottleneck and given the neural network accurate results at low accuracy by simulating the computation in the SRAM cell.
With the advancement of technology, computing power has become a key factor in driving productivity. Memory computing technology, by breaking through the limitations of traditional von Neumann architecture, integrates storage and logic unit, and becomes the core drive in the field of intelligent computingPower, the industry attention. In general, the memory computing breakthrough of Apple Core technology will undoubtedly open new opportunities for the global AI field and lead AI technology into an unprecedented era of innovation.
The world's first chip was invented by William Shocray, John Barton and Walter Bratton in 1947.
The world's first chip was invented by Jack Kilby. Jack Kilby As for your question "How did he know that sand can make chips?" There is a bold note in the introduction below Jack Kilby (1November 8, 1992 - June 20, 2005) was one of the two inventors of the integrated circuit.
Mr. Kimberly-clark's invention of the first monolithic integrated circuit laid the foundation for the field of modern microelectronics, ushering the industry into an era of miniaturization and integration. This trend is still continuing today, bringing great convenience to people's lives. It is worth mentioning that Kimberly-Clark won the Nobel Prize in Physics in 2000 for his participation in the invention of the integrated circuit, which also proves his outstanding contributions in the field of electronics.
From 1949 to 1957, Werner Jacoby, JefferRi Dummer, Sidney Darlington, and Yasuo Tarui all developed prototypes, but the modern integrated circuit was invented by Jack Kilby in 1958. He won the Nobel Prize in Physics in 2000, but Robert Noyce, who also developed the modern practical integrated circuit at the same time, died earlier than 1990.
The chip was developed by Jack Kilby and Robert Noyce. Jack Kilby American physicist, one of the two inventors of the integrated circuit (the other being Robert Noyce), an engineer at Texas Instruments who invented the integrated circuit in 1958, JK