1. Thermal conductive plastic shell: When the plastic shell is injected, the thermal conductive material is filled to increase the thermal conductivity and heat dissipation capacity of the plastic shell.
2. Air fluid dynamics: Using the shape of the lamp shell to create convective air, which is the lowest cost way to strengthen heat dissipation.
3. Aluminum fins: This is the most common way to dissipate heat, using aluminum fins as part of the shell to increase the heat dissipation area.
4. Surface radiation heat dissipation treatment: the surface of the lamp shell is treated with radiation heat dissipation. The simple thing is to apply radiation heat dissipation paint, which can bring the heat away from the surface of the lamp shell by radiation.
5. Heat conduction tube heat dissipation: The use of heat conduction tube technology, classroom lights, grille lights, magnetic lights wholesale heat from the LED full-color display chip to the shell heat dissipation fin. In large lamps, such as street lamps, etc. are common designs.
6. Fan heat dissipation: the lamp shell is reinforced by a long-life and efficient fan. This method has low cost and good effect. However, to change the fan is troublesome and not suitable for outdoor, this design is relatively rare.
7. Liquid bubble: Using liquid bubble packaging technology, the transparent liquid with high thermal conductivity is filled into the bulb body. This is currently in addition to the principle of reflection, the only use of LED chip surface heat conduction, heat dissipation technology.
8 heat conduction and heat dissipation integration - the use of high thermal conductivity ceramics, the purpose of heat dissipation of the lamp shell is to reduce the working temperature of the LED display chip, due to the LED chip expansion coefficient and our usual metal thermal conductivity, heat dissipation material expansion coefficient gap is very large, can not directly weld the LED chip, so as to avoid high and low temperature thermal stress damage to the LED display chip. The latest high thermal conductivity ceramic material, the thermal conductivity is close to aluminum, and the expansion system can be adjusted to synchronize with the LED full-color display chip. In this way, heat conduction and heat dissipation can be integrated to reduce the intermediate process of heat conduction.