To put it bluntly, the ultimate technology chips needed for mobile phones and computers have a huge technological margin for chips needed for modern weapons. At least for the momentBetween 30 nm and 5 nm, the effectiveness of the weapon is limited, but its reliability and stability are reduced, and the pursuit of the ultimate process is basically a cost-saving measure for weapon manufacturing. If it really has a big effect, all the weapons powers will increase their investment and pour money into it.
My answer is yes. Because in essence, the essential difference between the two is the number of transistors that can be contained in the same area. So in my opinion, if you do not consider the size factor, 14 nm chip as long as it is large enough to reach 5nm computing power. Of course, this is just from the theoryThe above analysis is possible. Among the practical factors, the gate problem of the transistor and the energy loss and whether it can be integrated should also be considered.
For the same chip area, 7nm has more transistors. Therefore, the 14nm chip and 7nm chip compared to the number of transistors is a lot less, in fact, the 14nm chip area and 7nm chip is not very large, so the former number of transistors is a lot less, in terms of performance and power consumption will be worse.
1, Huawei tries to change lanes to overtake, chip stacking technology is very feasible, and will also become the future trend.
2, second, emerging technologies will become the future core products of the integrated circuit industry. Third, the core technology and human resources become the sustainable development of the integrated circuit industry. In particular, it should be noted that the level of semiconductor self-sufficiency in China is very low, especially the extreme lack of core chips, and the domestic share is almost zeroThe announcement number is CN114450786A. The patent abstract shows that the application relates to the field of electronic technology to solve the problem of how to reliably bond multiple sub-chip stacking units to the same main chip stacking unit.
Huawei breaks through the barrier again: Recently, Huawei, China's most powerful technology company, announced a patent for "a quantum chip and a quantum computer", which is not the first time it has published a quantum chip patent, last year it was authorized to disclose a quantum key distribution system, methods and equipment related patents, showing that it is in quantum chip technologyA breakthrough has been made in the area.
In addition, once the Huawei chip problem is overcome, Huawei will be able to research and develop and officially break through the manufacturing process of high-end chips, and in the future, it will be able to enter the high-end chip field. Although Huawei is only engaged in chip research and development, Huawei's dual-core superposition process and the entry of Huawei's high-end chips may not fail to bring greater economic benefits to Huawei. With the help of the money ability, Huawei may not be able to achieve the return of the king in advance.
Solve problem 1: greatly reduce the difficulty of production As we all know, the production of a small chip requires the attention of the staff, more needsHigh precision lithography machine. Over time, companies producing lithography machines will sign orders with chip manufacturers to achieve mutual benefit and win-win results. However, the chip production difficulty is different, not only testing the production technology of the staff, but also testing the accuracy of the lithography machine.
Stacking the chips, some people will say that it will lead to an increase in the space of the phone, increase the difficulty of heat dissipation, and finally do not help the performance, increasing the power consumption. In fact, for chip transistorsThe understanding of stacking together package still stays after a chip stack, or a chip, and does not jump out of traditional thinking.
No. Huawei mate60pro stacks chips with different functions to form an overall technology. By tightly stacking functional modules such as processors, graphics chips, and neural network processing units together, it improves performance and reduces power consumption. This advanced process not only improves processor performance, but also reduces power consumption. It makes the mobile phone more smooth when running various applications.
If the Huawei mate60 Kirin chip is stacked successfully,Then this phone will have more powerful performance and more efficiency. From a technical point of view, the success of Huawei mate60 Kirin chip stacking is a technological breakthrough worth looking forward to. However, buying a phone is not just about its technical performance. Also consider the price of the phone, brand reputation, user experience and other factors.
This is the first time Huawei has publicly confirmed the chip stacking technology. That is to say, you can increase the area and stack the way to exchange for higher performance, and achieve the competitiveness of low-process to catch up with high-performance chips. According to past experience, when Huawei announced a technologyOften has proven its feasibility. This also means that Huawei's chips using chip stacking technology are likely to come out in the near future.
In theory, by stacking and increasing the area, the 14nm chip can be compared with the 5nm chip in performance. This is like pulling a car, the high-performance 7nm chip is a tall horse, 14nm, 20nm chip is a small donkey, a tall horse can pull a car, several small donkeys can also pull a car.
Huawei chip attempts to overtake in a corner, explore chip stacking and chip stacking technologyIt is feasible and can greatly improve the performance of the chip, but the most important thing is the packaging process of the chip.
1, zen3D power consumption 600W. AMD will add the 3D stacked cache to the Zen3 plus processor to improve the performance of the CPU, but perhaps due to process limitations, the power consumption of this generation of processors has been greatly improved, and now it is reported that the power consumption of the EPYC processor to be released by AMD in the future will reach 600 watts.
3. SKHynix's HBM2E is based on a speed performance of 6GBps per pin and supports speeds of more than 460GB per secondThere are 1,024 I/ OS. It is the fastest DRAM solution in the industry, capable of transferring 124 FHD movies per second. SKHynix Mass Production HBM2EDRAM-TSV Achieves higher density by vertically stacking 16GB chips By vertically stacking eight 16GB chips with TSV technology at a density of 16GB, more than double that of the previous generation.
4, the chip physical computing power reaches 256TOPS@INT8, typical power consumption 35W, simple calculation can be obtained, SoC level energy efficiency ratio reached 3TOPS/Watt, while in the traditionalUnder the von Neumann architecture, using the same 12nm process, the energy efficiency ratio can be achieved at the level of 2TOPS/Watt.