SIP chip: Multiple active electronic components with different functions and optional passive devices, as well as other devices such as MEMS or optical devices, are preferentially assembled together to achieve a single standard package with certain functions, thus forming a system or subsystem. From the perspective of package development, SIP is the foundation of SOC package implementation.
In the 5G era, this technology can help integrate chips on different systems to drive innovation for iot applications such as Internet of Things (IoV), edge computing, data centers, smart homes, smart factories, and smart cities. While chip design costs are steadily climbing as processes move toward 7nm, 5nm, and even 3nm, advanced IC packaging technologies will play a key role in reducing costs for chipmakers, industry insiders said.
SIP chips can help chip manufacturers reduce the amount of silicon IP verification required and can provide greater flexibility in integrating heterogeneous chipsets with different capabilities. In addition, SIP can help chip manufacturers cut system development costs and reduce the complexity of the required PCB boards.