Simply put, a layer of gold is deposited on a piece of glass, and then part of this layer of gold is heated and melted and poured onto the bottom of the substrate. And then an etching is done in this place, which is to carve an integrated circuit into this gold surface. This step makeOnce that's done, the chip needs to be polished. Then the metal on the chip is electroplated. The end result is the semiconductor chips commonly found in electronics.
Lithography is one of the core technologies of chip manufacturing, which can transfer the circuit pattern on the chip to the wafer. Lithography technology requires the use of equipment and materials such as photolithography machines and photoresist. Etching technology Etching technology is a key step in transferring the circuit pattern on the wafer to the semiconductor material. Etching technology requires the use of equipment and materials such as etching machines and etching fluids.
The same chip core can have different packaging forms,The reason is that the chip is fixed, the pins are bundled, and different packaging forms are made according to needs. For example: DIP, QFP, PLCC, QFN, etc., which mainly depends on the user's application habits, application environment, market shape and other peripheral factors. Testing and packaging through the above process, chip production has been completed. This step is to test the chip, remove the defective product, and package it.
Raw materials for single Wafer: The raw materials for chip production are mainly Silicon wafers, which are a round sheet of high-purity silicon. Lithography: Fabrication on silicon wafers with special equipment will be requiredThe circuit pattern is repaired by exposure, that is, Photolithography, and then the pattern is formed chemically. This process needs to be repeated many times, gradually forming a complex circuit pattern.
How the chip is made is as follows: Chip design. The chip is a product of small size but high precision. If you want to make a chip, design is the first step. The design needs to use EDA tools and some IP cores, and finally make the chip design blueprint required for processing. Sand and silicon separation. All semiconductor processes start with a grain of sand. Because the silicon in the sand is rawPurpose; 1 Repeat the steps of 6; 1 Repeat the steps of 7 9 to make a hollow template of the chip internal connection line on the wafer surface; 1 The outer surface of the wafer is gold-plated; 1 Remove all photoresist; 1 Cut the wafer into chips; 1 Fix the chip on the integrated circuit base, weld and package.
The manufacturing process of integrated circuits is divided into the following steps: First, the wafer manufacturer will purify the silicon, dissolve it into a liquid state, and pull out the columnar silicon pillars. While rotating, forming, the speed of rotation and temperature control affect the overall quality. The pillars are cut into thin slices and polished to become wafers.
In a self-aligned (CMOS) process, all gate layers (polycrystalline silicon or metal) pass through the diffusion layer to form a transistor. The resistance structure, the aspect ratio of the resistance structure, combined with the surface resistance coefficient, determines the resistance. The capacitor structure, due to size limitations, can only produce a small capacitance on the IC. More rare inductor structures can be made on-chip inductors or simulated by a gyroscope.
Cell phone chips are made of semiconductor materials. Semiconductor is a kind of intermediateThe material between the conductor and the insulator, its resistance changes with temperature, light, electric field and other factors. Semiconductor materials are widely used in the manufacture of electronic devices, such as transistors, diodes, integrated circuits, etc.
Cell phone chips are made of silicon. The main raw material of the mobile phone chip is the wafer, and the raw material of the wafer is the silicon in the sand, so the chip of the mobile phone computer is mainly composed of silicon.
The chips in mobile phones and computers, like memory chips, are semiconductors composed of integrated circuits, and their main raw material is silicon in the sand. What is the core of mobile phone computer chipChips and memory chips are semiconductors composed of integrated circuits, and their main raw material is silicon in the sand.
The raw material of the chip of the mobile phone computer is the wafer, the composition of the wafer is silicon, so the chip of the mobile phone computer is mainly composed of silicon. Silicon is refined from quartz sand, the silicon element is purified in wafers, and these pure silicon are then made into silicon rods, which are used to make integrated circuits.
Aluminum wire connectionThe wiring that holds the components together tightly is made of aluminum wire. This material has good electrical conductivity and plasticity, which can meet the high density wiring needs of chips. The heat resistance of the chip is closely related to the material of the silicon semiconductor, the manufacturing process and the heat dissipation capacity of the package.
The magical journey of semiconductor chips From internal design to protection of the outside world, package testing plays a key role. In this process, we gain insight into how CP test equipment ensures chip quality, as well as its purpose and challenges. The package, like the armor of the chip, is divided into ceramic, metal and plastic three types, eachThere are unique advantages and disadvantages: ceramic packaging provides excellent insulation, metal is known for efficient heat dissipation, and plastic packaging is lightweight and cost-effective.
First, the wafer cutting technology divides large wafers into tiny chip particles through precise manipulation, using anti-static materials and precision cooling. The chip is then pasted to the lead frame via a silver paste, ensuring good heat transfer. The gold wire bonding completes the physical connection between the chip and the pin, and the electrical connection is realized through high temperature sintering and stretching technology.
The deposition step starts with the wafer, which is a 999% pure silicon cylinder (also called "silicon ingot").A thin film of conductor, insulator or semiconductor material is then deposited onto the wafer according to the structural requirements so that the first layer can be printed on it. This important step is often referred to as deposition. As chips get smaller, printing patterns on wafers becomes more complex.
At the end of semiconductor manufacturing, interconnection and testing are the guardians of quality control. Metal interconnects, evolving from aluminum to copper, ensure low resistance and stable performance. During the test phase, EDS and EPM technologies are screened one by one to ensure the perfect quality of the chip. Packaging, past manual cumbersome, such asAutomation is making great strides forward. Cutting, single chip attachment, interconnecting (including lead bonding and flip chips), forming and testing, each step has witnessed a technological leap forward.
With the development and evolution of process nodes from 5nm to 3nm, the difficulty of chip manufacturing is gradually approaching the physical limit. The iteration of the process follows Moore's Law: each generation of the process doubles the number of transistors on a chip for each successive workArt node naming is about 07 times that of the previous generation.
Mainly manufactures digital signal processing chips, which generally require 1500 processing steps from start to finish.
. Package chip: What are the external conditions required to cut the wafer, form a single chip, and package the chip manufacturing? Different kinds of lithography machines and ultra-clean rooms. The chip is like a mini skyscraper, its structure can reach more than 100 layers, and the layers overlap with each other with nanometer precision, which is also known as "engraving precision."