The package shape is different, the welding process is different, and the rated power consumption of some components and patches will be different.
Components of the in-line and patch type are two common installation methods, they have some differences in symbol representation. In-line: In-line components are inserted directly into pre-drilled holes on the printed circuit board (PCB) through pins. In the circuit diagram, the in-line elementThe symbol of the device is usually represented by a rectangle, and the pin is represented by a straight line. Pins protrude from both sides of the component and are connected to other components or circuit nodes by connecting wires.
Chip and in-line are both common forms of chip packaging, they are functionally the same, but the chip size of the patch is smaller, compared to the in-line chip, it will also consume less power. However, the in-line chip also has its advantages, if the hole plate is welded, the chip package is not good for welding.
Domestic chips are generally derived from foreign countries, like plug-ins is a lot of foreigners love better thanPixel painting is an example. 2: Many chip manufacturers, such as Mortolola or the United States half company, such as LM and MRF are only plug-ins, patches have not been launched, the main reason is that the simulator model update is slow, redesign package cost is not low.
Different applications: SMT patch refers to a series of process processes on the basis of PCB. PCB (Printed Circuit Board) is a printed circuit board. The integrated circuit that manufactures the circuit on the surface of the semiconductor chip is also called thin-film integrationThe circuit.
Compared to the good point of direct insertion: the pin of the direct insertion MCU is basically the same one to one, and can be changed at any time. For example, the same stc's in-line MCU, model A is the one you are using now, and the i2c operation is simulated when operating i2c.
1, the number is different, including different categories. The quantity is different. The chip refers to a single chip, and the sleeve refers to a scheme or a board that uses two or N main chips. Include category noSame. The mobile phone chip includes baseband, processor, coprocessor, etc., and the mobile phone cover includes intermediate frequency, power supply, power amplifier, FLASH, camera and so on.
2, mobile phone cover refers to the mobile phone chip. Mobile phone chip is a classification of IC, is a silicon board collection of a variety of electronic components to achieve a specific function of the circuit module. It is the most important part of the electronic equipment, bearing the function of computing and storage.
3, it can be said that the direction is different. Q6: What does the case on the mobile phone mean? mtk uses Lianfa's MT620MT621MT621MT621MT622MT622MT6228 baseband chip, the chip adopts ARM7 core.
1, the second paragraph: The difference between the patch area and conventional components The patch area refers to the manufacturing area on the circuit board using the surface mount process, often used to install SMD (surface mount device) components, including electrolytic capacitors, inductors, crystal oscillators, resistors, etc. Compared with conventional components, the chip components are smaller and lighter, do not need holes, and are made ofThe board is thinner, the service life is longer, and the corresponding flexibility is also higher.
2, there is no difference, the method is the same. The basis of patch components and non-patch components will not change, it mainly does not take up space to reduce the volume, like this case of a broken component, it is difficult to repair, generally replaced.
3, the difference is as follows: SMD is a component, SMT is a technology and process, one is an object, one is a non-object. The role is different, SMD is used after the first automated machines are introduced, they can place some simple pin elements, while SMT is a will no pins or short leadsSurface assembly components Circuit mounting technology mounted on the surface of a printed circuit board.
4, the role is different, SMD is used after the first automated machines are introduced, they can place some simple pin components, and SMT is a pin-less or short-lead surface assembly components installed on the surface of the printed circuit board circuit mounting technology. SMD is also short for Samsung Mobile Display, while SMT simply stands for a technology.
5, but the patch is better than the plug-in fastness of the patch components, small size, accounting forChips are generally from abroad, like plug-in is a lot of foreigners love good, such as pixel painting is an example. 2: Many chip manufacturers, such as Mortolola or the United States half company, such as LM and MRF are only plug-ins, patches have not been launched, the main reason is that the simulator model update is slow, redesign package cost is not low.
Integrated circuit according to its production process, can be divided into semiconductor integrated circuit, film integrated circuit and hybrid integrated circuit three categories. Semiconductor integrated circuit is the use of semiconductor technology, including resistance, capacitor, transistor, diode on the silicon substrate productionAn integrated circuit with such components and a certain circuit function; Membrane integrated circuits are passive devices such as resistors and capacitors made in the form of "membranes" on insulating objects such as glass or ceramic sheets.
Chip and in-line are both common forms of chip packaging, they are functionally the same, but the chip size of the patch is smaller, compared to the in-line chip, it will also consume less power. However, the in-line chip also has its advantages, if the hole plate is welded, the chip package is not good for welding.
The difference is as follows: SMD is a component, SMT is a technology and process, aThere are objects and there are non-objects. SMD was used after the first automated machines were introduced, and they could place some simple pin components, while SMT is a circuit mounting technology that attaches pin-less or short-lead surface assembly components to the surface of the printed circuit board.
The reasons for the first CHIP and then IC in the SMT mounting process are as follows: CHIP refers to the silicon chip containing the integrated circuit, which is cut from the Wafer of a collection of many pieces, and is small in size, often part of a computer or other equipment. The IC is short for integrated circuit, isA miniature electronic device or component. IC components usually contain multiple chips that can perform complex electronic processing functions.
1, the direct insertion of components and the patch type are two common installation methods, and they have some differences in symbol representation. In-line: In-line components are inserted directly into pre-drilled holes on the printed circuit board (PCB) through pins. In the circuit diagram, the symbol of the in-line component is usually represented by a rectangle, and the pin is represented by a straight line. leadThe feet extend from both sides of the component and are connected to other components or circuit nodes by connecting wires.
2, patch and in-line are common forms of chip packaging, they are the same in function, but the chip size of the patch is smaller, compared to the in-line chip, its power consumption will be lower. However, the in-line chip also has its advantages, if the hole plate is welded, the chip package is not good for welding.
3, domestic chips are generally from abroad, like plug-in is a lot of foreigners love good, such as pixel painting is an example. 2: Many chip manufacturers, such as MagicTorola or the United States half of the company, such as LM and MRF is only plug-in, patch has not been launched, the main reason is that the simulator model update is slow, redesign package cost is not low.
4, hello direct insert is a guide line frame package, with two pins of epoxy resin packaging form patch type refers to the table paste flat package, the light Angle is relatively large, the volume is relatively small. The integrated one packs only N chips in a bracket.
5, the patch and in line. The difference is that the board is inserted directly through the hole, and the patch is attached to the table. The appearance of obvious noThe same is that the straight inserted foot is extended downward and relatively long, and the patch is extended to both sides of the tube body. The narrow body, the wide body, can be distinguished according to the foot spacing, it is best to find the specifications compared, which is much clearer than the text.