The packaging of electronic components, simply put, is to lead out the circuit pin on the silicon chip with a wire, connected to the external connector, convenient and otherDevices are connected. The package form is a customized shell for semiconductor integrated circuit chips. This paper will discuss the importance of electronic component packaging and the impact of packaging technology.
In the field of electronic components, packaging usually refers to the process of enclosing a chip or other microelectronic device in a housing. This shell is designed in a variety of forms, it not only provides physical protection, but also plays a role in connection and heat dissipation.
Component packaging refers to the process of wrapping electronic components (such as integrated circuit chips, transistors, etc.) in a protective shell. This enclosure helps protect electricitySub-components are protected from environmental impacts, provide mechanical support, and provide connectors or pins for mounting components into circuit boards or other systems.
With the trend of miniaturization of electronic products, the packaging of electronic components is becoming more and more miniaturized, such as QFN package is a pin-free flat package, which can be widely used in small electronic devices.
The packaging of electronic components is the process of placing tiny electronic devices (such as chips, transistors, etc.) in an external protective structure. This external structure is usually made of specific materials to provide physical protection, connection pins, heat dissipation, and moreType package (DIP), transistor outline package (TO), pin grid array package (PGA) and so on. Typical surface mount such as transistor outline package (D-PAK), small outline transistor package (SOT), small outline package (SOP), square flat package (QFP), plasticated lead chip carrier (PLCC) and so on. Computer motherboards generally do not use in-line package MOSFETs, this article does not discuss in-line package MOSFETs.
3. PFPF (plastic flat package). Plastic QFAnother name for P (see QFP). MSP (mini square package) Another name for QFI (see QFI), it was often called MSP in the early stages of development. QFI is the name prescribed by the Japanese Electronic Machinery Industry Association. LQFP (low profile quad flat package) Thin QFP.
4, component packaging refers to the electronic components (such as chips, resistors, capacitors, etc.) packaged in a specific shell for easy installation and use. Packaging can not only protect components from damage, but also provide goodMechanical and thermal properties to meet different application requirements. On electronic component procurement platforms such as Epeixin City, component packaging refers to the appearance size and shape of components, as well as the arrangement and layout of pins.
5, there are many kinds of electronic components brand and package, the following are some of the more well-known electronic components brand and package: brand: Samsung, Toshiba, Intel, Qualcomm, Dell, HP, LenovoLet's wait.
6, one of TCP (on-load package). Pins are made on the insulating tape and lead from both sides of the package. Due to the use of TAB (Automatic on-load welding) technology, the package shape is very thin. Often used for liquid crystal display drive LSI, but most of the products. In addition, a 0.5mm thick memory LSI bookshaped package is under development. In Japan, DICP is named DTP according to the EIAJ (Japanese Electronic Machinery Industry) Association standard.
In the field of electronic components, packaging usually refers to the process of enclosing a chip or other microelectronic device in a housing. This shell is designed in a variety of forms, it not only provides physical protection, but also plays a role in connection and heat dissipation. Specifically, the package includes the following aspects: Physical protection: The package provides physical protection for the internal electronic components, preventing them from being damaged by dust, moisture, chemicals, etc.
Component packaging refers to the electronic components (such as integrated circuit chips, transistors, etc.) wrapped in a protective shellThe process of... This housing helps protect electronic components from environmental impacts, provides mechanical support, and provides connectors or pins for mounting components into circuit boards or other systems.
Component packaging refers to the packaging of electronic components (such as chips, resistors, capacitors, etc.) in a specific housing for easy installation and use. Packaging can not only protect components from damage, but also provide good mechanical and thermal performance to meet the needs of different applications. On electronic component procurement platforms such as Epeixin, component packaging refers to the appearance size and shape of components, as well as the arrangement of pinsAnd layout, etc.
In modern electronic products, component packaging is an essential part. Encapsulation refers to the placement of electronic components in a specific housing to protect the components and provide connectivity. Component packaging can make electronic products more stable, reliable, and easier to manufacture and repair. In this article, we will learn about the importance of component packaging, the different types of packaging, and how to choose the right package.
Component packaging refers to the processing of electronic components into packages suitable for installation and surface welding. Component packaging can help electronic components in the circuit boardIt is easier to install and weld during production, which increases the reliability and stability of the board.
The package of the electronic component is the shape of the electronic component. The circuit design for PCB packaging is based on the size of its outline and the size of the pin and draw the PCB welding diagram, also commonly known as the PCB packaging of this component.
1, DIP (Dual In-line Package) package: DIP package is one of the earliest forms of chip packaging, it hasTwo rows of pins, in a long strip shape. Common DIP package sizes are DIPDIP1DIP1DIP20, and the number indicates the number of pins. This package is suitable for manual welding on the PCB board. QFP (Quad Flat Package) package: QFP package has four sides, each side has a pin, in a flat shape.
2, package type is different, TO-220 is in line, TO-263 is patch type. Below, the first is the TO-263 package and the second is the TO-220 package. TO-263 package: TO-220 Package: Package sizes vary. The dimensions of the TO-220 and TO-263 packages are shown below.
3, 0201 package: its size is 0.6mm x 0.3mm. 0402 package: Its dimensions are 0mm x 0.5mm. 0603 package: Its dimensions are 6mm x 0.8mm. 0805 package: Its dimensions are 0mm x 25mm. 1206 package: Its dimensions are 2mm x 6mm. In addition, there are also larger size patch resistors, such as 121812010 and so on.
4,MAX232 packages are available as follows: CDIP (N) /16, LCC/20, PDIP (N) /16, SOIC (N) /16, SOIC (W) /16, TSSOP/16. MAX232 is a chip that converts the RS232 signal level (-10, 10v) of the serial port of the computer into the TTL signal flat (0, 5) used by the MCU.
5. Package: L: 2inch (2mm) W: 0.6inch (6mm). The 0805 package is L: 0.8inch (0mm) W: 0.5inch (25mm). Package sizes are long x wide, 0805,0603,1206 These units are in imperial, 0805 stands for 0.8 inches x0.5 inches, while 1 inch =24 mm.