1, the size and size of electronic chips are differentSOT-353 is smaller than SOT2SOT-23-5. The PITCH (distance from the center point of the part foot to the center point of the part foot) is different; SOT both stand for small transistor packages. The number after the SOT only indicates that the sequence has no practical significance, and the number generally corresponds to different pin spacing. The SOT25 has three pins, the SOT-353 has four pins and the SOT-23-5 has three pins.
2, a wide variety of IC packaging, in practical applications, different scenarios need to use different packaging forms. Common IC packaging forms include: DIP, PLCC, PGA, BGA, etc. DIP is a dual-in-line package suitable for simpler electronic devices. PLCC and PGA are suitable for high-density packaging and high-speed computing applications. BGA is suitable for high-density packaging and high power implementation.
3, DIP Package DIP is the abbreviation of English Double In-line package, that is, double in-line package. One of the plug-in type packages, the pins lead from both sides of the package, and the packaging material is plastic and ceramic. DIP is the most popular plug-in package for applications including standard logic ics, memory LSI,68 ~ 1969 Phillip Company successfully developed, Later, it gradually derived SOJ (J-pin small shape package), TSOP (thin small shape package), VSOP (very small shape package), SSOP (reduced type SOP), TSSOP (thin reduced type SOP), SOT (small shape transistor), SOIC (small shape integrated circuit) and so on.
Two-side pin flat package. Is another name for SOP (see SOP). The term used to be used, but it is no longer used. DIC (dual in-line ceramic package) Another name for ceramic DIP (with glass seal) (see DIP). 1DIL (dual in-line) DIP (see DIP). European semiconductor manufacturers use this name. 1DIP (dual in-line package) Dual in-line package.
Characteristics and advantages of various semiconductor packaging forms: DIP dual in-line Package DIP (DualIn-line Package) refers to the use of dual in-line package integrated circuit chips, the vast majority of small and medium-sized integrated circuits (IC) are in this form of packaging, and the number of pins is generally not more than 100. A CPU chip in a DIP package has two rows of pins that need to be plugged into a chip socket with a DIP structure.
The fine step of the lead bonding package begins with the cutting. After the precision wafer is thinned, the automated tool accurately slices it to ensure smooth and silky edges. The chip is then carefully bonded to the matching size pad, with the use of soft solder or polymer to enhance the stability of the connection. Gold thread bonding artThe metal wire bonding technology is the key link, and the combination of hot pressure welding and thermoultrasonic welding technology requires high linear precision and the bonding arc is just right.
The typical packaging process is: scribing, loading, bonding, plastic sealing, flash removal, plating, printing, slitting and molding, appearance inspection, finished product testing, packaging and shipping.
According to the product specification, the following diagram illustrates how to package. tool-component wizard. Select the type DIP to encapsulate. Select the hole and pad size according to the specification. Select up, down and left and right holes according to the specificationsThe distance and size of the screen print of the border can be selected as default. Fill in the number of actual pins according to the chip, fill in the package name you want to enter, here is still named according to the actual name of the chip.
DIP (Dual in-line Package) package: DIP package is one of the earliest forms of chip packaging, it has two rows of pins, In a long strip. Common DIP package sizes are DIPDIP1DIP1DIP20, and the number indicates the number of pins. This type of encapsulationSuitable for manual welding on PCB board. QFP (Quad Flat Package) package: QFP package has four sides, each side has a pin, in a flat shape.
Package type is different, TO-220 is in line, TO-263 is a patch type. Below, the first is the TO-263 package and the second is the TO-220 package. TO-263 package: TO-220 package: Package sizes vary. The dimensions of the TO-220 and TO-263 packages are shown below.
0201 Package: Its size is 0.6mm x 0.3mm. 0402 package: Its dimensions are 0mm x 0.5mm. 0603 package: Its dimensions are 6mm x 0.8mm. 0805 package: Its dimensions are 0mm x 25mm. 1206 package: Its dimensions are 2mm x 6mm. In addition, there are also larger size patch resistors, such as 121812010 and so on.
MAX232 packages are available as follows: CDIP (N) /16, LCC/20, PDIP (N) /16, SOIC (N) /16, SOIC (N) /16)W) /16, TSSOP/16. MAX232 is a chip that converts the RS232 signal level (-10, 10v) of the serial port of the computer into the TTL signal flat (0, 5) used by the MCU.
System-level Chip CSP Chip Size Package Chip size package COB Chip On Board chip SMT baseA Accuracy: The difference between a measured result and a target value. Additive Process: A method for manufacturing conductive PCB wiring by selectively depositing conductive materials (copper, tin, etc.) on the plate layer. Adhesion: similar to the attraction between molecules.
chip components are chips (collectively referred to as semiconductor component products). chip/chip (chip) or microcircuit (microcircuit), microchip (microchip). inIn electronics, a way of miniaturizing circuits (mainly semiconductor devices, but also passive components, etc.), often on the surface of semiconductor wafers.
SOT and SOC are both abbreviations that mean different things. SOT stands for System-on-a-chip, or integrated circuit System. SOC refers to Social Order Changes. Although the abbreviations are similar, the meanings are completely different, and the specific meanings need to be understood according to the context. SOT stands for Integrated Circuit System, and it'sOne of the most important concepts in modern electronics.
The reasons for the first CHIP and then IC in the SMT mounting process are as follows: CHIP refers to the silicon chip containing the integrated circuit, which is cut from the Wafer of a collection of many pieces, and is small in size, often part of a computer or other equipment. The IC is short for integrated circuit, which is a miniature electronic device or component. IC components usually contain multiple chips that can perform complex electronic processing functions.
I have been in SMT for many years, but also trained a lot of people, of course, including some knowledge of operators.
chip component height. smt furnace temperature is a large heating test equipment, the equipment is high chip components. Chip refers to the silicon chip containing the integrated circuit, which is cut from a collection of wafers. The small size is often part of a computer device.
2, chip packaging, like the exquisite armor of electronic products, its definition includes both the narrow chip shell installation, but also covers a wide range of assembly, connection and installation process. A variety of packaging materials, such as ceramic, glass, metal and plastic, each play a role in protecting the stable operation of the chipA key role.
3, packaging, is to put the circuit pin on the silicon chip, with a wire connection to the external junction, in order to connect with other devices. Package form refers to the housing used to install semiconductor integrated circuit chips.
4, packaging, is the integrated circuit assembly into the final product of the chip process, simply put, is the foundry produced by the integrated circuit bare (Die) on a bearing role on the substrate, the pin out, and then fixed packaging into a whole.
5, the chip package is the shell used to install the semiconductor integrated circuit chip, with anThe function of placing, fixing, sealing, protecting chip and enhancing electric heating performance.