1, market demand and treatment for engineers skilled in advanced testing machines, the current market treatment is good. The specific salary can be understood through recruitment websites such as 51job or Liepin, and communicate with HR in person to get more accurate information.
2, the prospect of chip IC test engineers is still good. Test engineer, the gatekeeper of software quality, has a high starting point and large development space. The software testing profession in our country is still at a developing stage, so the testing engineer has a great prospect.
3,Produced by the assembly line, the amount of tasks every day is also relatively heavy and the most important is that the same work does not have any fun at all, so it is still relatively hard. Generally speaking, the electronic chip itself is not radiating, but there will be a little radiation in the process of chip production.
2. The salary is very high. Huawei Hisilicon official website salary statistics, the average salary of Huawei Hisilicon is 24,598 yuan/month, of which 50% of the salary income is in the range of 15,000-20,000 yuan/month, 25% of the salary income is in the range of 25,000-30,000 yuan/month, analysis of data statistics, Huawei SeaThe average annual bonus of Si is 58,500 yuan, and the salary of Huawei Hisilx is very high.
3. The treatment of Huawei hisilx department is basically as follows: the average salary of Huawei Hisilx is 24,223 yuan/month, of which 50% of the salary income is in the range of 15,000-20,000 yuan/month, and 25% of the salary income is in the range of 25,000-30,000 yuan/month. According to the analysis data, the average annual bonus of Huawei Hisilx is 58500 yuan. There are social insurance (5 insurance), housing provident fund. I often work late and occasionally work overtime on Saturdays and Sundays.
4, Good. In 2022, Hisilicon chips in ShanghaiThe salary of R & D engineers working is 20,000 yuan per month, the salary is high, the welfare system is complete, and there will be gifts, so it is good. Working in the institute is the institute to help pay five insurances and one gold words have various kinds of insurance, and make good research and bonus, so it is good.
5, the workload is relatively large, can be long-term development, the starting salary of this industry is so high, in the industry is very popular, such companies are not many, just graduated college students, the most should go to Huawei Hisilx such enterprises, so the competitive pressure is still there. So it's not easy to get in. Yes. In terms of getting along. Huawei hisiliconComfortable office environment, humanized corporate culture. Colleagues get along well with each other, help each other, like a family. In terms of hygiene.
ATE (Auto Test Equipment) is completed in the test plant, which is roughly to apply the required excitation signal to the input pipe of the chip, while monitoring the output pin of the chip to see if its output signal is the expected value. There are specific test beds.
in different ways. ATE is an automatic test device for electronic products or elementsDevice production line testing, including functional testing, reliability testing, environmental testing, etc. Functional testing is to verify and test the function of the product, and functional testing usually involves three aspects of input, processing and output testing.
ATE is the abbreviation of Automatic Test Equipment, the Chinese name is automatic test equipment. In electronics factories, ATE is used to test and inspect manufactured electronic products to ensure that their quality and performance meet standard requirements. ATE comes in many different forms, including simple computer-based test programs and complex test systems that canIt can test various electronic devices, circuit boards and entire systems.
ATE test, function test, reliability test. ATE test: According to the type of test vector, it is divided into DFT test and functional vector test. According to the test stage, it is divided into CP test and FT test. The DFT test includes ATPG and BIST tests. It mainly covers the digital part of the DFT chain that is plugged in and the IP that supports BIST testing. CP test and FT test refer to the test of waferlevel before packaging and the test of packagelevel after packaging.
Static electrical parameter test: test the static electrical parameters of the power chip, including current, voltage and other parameters. These parameters determine the performance and stability of the chip. Dynamic electrical parameter test: test the dynamic electrical parameters of the power chip, including switching characteristics, response speed, etc.
Check board method: observation method: there is no burning, burning, foaming, plate surface broken line, socket rust. Meter measurement: 5V, GND resistance YesNo It is too small (under 50 ohms).
Semiconductor test technology includes a variety of different test methods, such as electrical performance testing, functional testing, component verification, and device characteristic testing. Electrical performance testing consists of measuring the electrical characteristics of a semiconductor device (such as resistance, capacitance, and inductance) to determine whether it meets the expected parameter requirements.
1, according to its official information, there is no non-patch package, CH340G is patch sop-1The CH340T is a ssop-20 patch. G is twice as wide as T.
2, you can use a multimeter to measure the resistance or voltage of the chip's power supply end to the ground, and you can also measure whether the voltage at each corner is normal.
3, package: DIP1SOP16 Overview JX1126 is a single integrated LED digital display voltmeter control chip, 3-bit digital tube display, voltage display range 0V-39V.
4, the width of the volume, excluding the width of the pin there are three kinds, 9mm, 2mm, 2mm.
2, the chip test is a test for the chip itself, mainly to verify that the performance and function of the chip meet the design requirements. chipThe test usually uses professional test equipment and test procedures to measure and analyze the input signal and output signal of the chip to detect various indicators of the chip, such as voltage, current, timing, power consumption, etc. The purpose of chip testing is to ensure the quality and reliability of the chip, and to provide support for the subsequent product design and production.
3, second, chip testing is the electrical performance test and reliability test of the packaged chip to ensure that the quality and performance of the chip meet the requirements. The main process of chip testing includes test program writing, test equipment debugging, test data analysis and so on. The main refers to chip testingThe standard includes electrical parameter, function test, temperature cycle test, humidity cycle test and so on.
4, in the process of chip manufacturing, chip testing is a very important step to test whether the quality and performance of the chip meet the requirements. Therefore, chip testing is an indispensable link in industrial production, which is directly related to the quality and production efficiency of the chip. Chip testing is also an important industry in the commercial sector. With the continuous expansion of chip application range, the market demand of chip testing is also increasing.
5, the downstream mainly includes chip design companies, chip manufacturing companies and packagingAnd test vendors. Wafer manufacturing process testing is also known as intermediate testing.
6, the magical journey of semiconductor chips from internal design to the protection of the outside world, package testing plays a key role. In this process, we gain insight into how CP test equipment ensures chip quality, as well as its purpose and challenges.