The positive and negative resistance values between the pins of the IC chip to the ground are measured by off-line detection. It is compared with a good IC chip to find the fault point. On-line detection of DC resistance is the same as offline detection.
Visual inspection: Make sure there are no obvious signs of damage, such as burned components on the chip, broken leads or welding problems, thisGas safety detector.
2, the equipment includes four wafer appearance detection machine, wafer spot bright detection machine, wafer removal machine, laser welding machine.
3, MiniLED repair needs testing equipment, crystallization equipment, welding equipment. Like the Mini LED intelligent detection and repair line of Heyi Technology used here, there are appearance detection machines, light detection machines, wafer removal machines, laser welding machines.
4, mini led repair equipment generally includes appearance detection machine, light detection machine, wafer removal machine and laser welding machine.
5. Heyi Technology's mini led repair equipment is highly recommended.
6, this I think is Heyi technology equipment yield is relatively high, like Mini LED repair need appearance detection machine, light detection machine, wafer removal machine and laser welding machine are independently developed and produced by them, and master the core technology.
1, Test Handler: used to test and classify the chip, usually including the test head, probe card and machineMechanical arms and other components. Wire Bonder (Wire Bonder) : Used to connect the chip to the pin of the package device, usually using gold or copper wire for connection.
2, microscopic imaging equipment: mainly including optical microscope, scanning electron microscope, etc., for the observation and analysis of material microstructure images. Chemical analysis equipment: mainly includes electron probe, energy spectrometer, Raman spectrometer, etc., used for chemical composition detection and analysis.
3, welding machine: welding machine is used to connect the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding.Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. This device can simulate the stress and temperature environment in real use.
4, the main semiconductor packaging and testing equipment includes: thinning machine. Thinning machine is to thin the wafer substrate by thinning/grinding, improve the chip heat dissipation effect, thinning to a certain thickness is conducive to the later packaging process. Four probes.
5, semiconductor devices are electronic devices made of semiconductor components. Semiconductor equipment includes laser marking machines, laser inkjet printers, packaging machines, water purifiers, etc.A semiconductor is a material with an electrical conductivity between a conductor and an insulator at room temperature. It is widely used in semiconductor radio, television and temperature measurement.
6, common semiconductor packaging equipment includes: chip sorter: used to separate the chip from the wafer. Pad preparation equipment: a pad for preparing chip connections, including a spherical pad preparation equipment and a flat pad preparation equipment.
Let's start with detecting integrated circuitsRequired tools, soldering iron, heat gun, basic tools for disassembling welded integrated circuits, multimeter This is also a basic measuring tool, voltage regulator can output a stable voltage to the device under test.
From a practical point of view, based on my personal experience, I recommend a "transistor characteristics diagram", you can measure the breakdown characteristics of each pin to the ground, if there is any pin to the ground leakage, you can conclude that the quality of the integrated block is not good. In addition, a common approach is to conduct functional testing.
Test Handler: used to test and classify chips,Components such as test heads, probe cards, and robotic arms are typically included. Wire Bonder (Wire Bonder) : Used to connect the chip to the pin of the package device, usually using gold or copper wire for connection.
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