1, the role of solder paste printing is to solder paste at a 45 degree Angle with a scraper to print on the PCB pad, to prepare for the welding of components. The equipment used is a printing press (solder paste press), located at the very front of the SMT production line.
2, the role of parts mounting is to accurately install the surface assembly components to the fixed position of the PCB. The equipment used is the placement machine, located behind the printing machine in the SMT production line, generally for high-speed machines and general-purpose machines used in accordance with the production needs.
3, the role of reflow welding is to melt the solder paste, so that the surface assembly components and PCB firmly welded together. The equipment used is reflow furnace, located behind the SMT machine in the SMT production line, and the temperature requirements are quite strict, requiring real-time temperature measurement, and the measured temperature is reflected in the form of profile.
4, the role of AOI optical detection is to detect the welding quality of the welded PCB. The equipment used is an automatic optical inspection machine (AOI), and the location can be configured in the appropriate place of the production line according to the needs of the inspection. Some before reflow welding, some after reflow welding.
5, the role of maintenance is to detect the fault of the PCB repair. The tools used are soldering iron, repair workstation, etc. Configured after AOI optical inspection. The function of the multi-board PCBA is segmented to separate it into a single individual, generally using V-cut and machine cutting methods. SMT is a Surface assembly Technology (short for Surface Mount Technology), known as surface mount or surface mount technology. It is the most popular technology and process in the electronic assembly industry at present. It is a pin-free or short-lead surface assembly component (referred to as SMC\/SMD, Chinese called chip components) installed on the surface of the Printed Circuit Board (PCB) or other substrate surface, by reflow or dip welding and other methods to weld the assembly of the circuit installation technology. SMT red glue is a polymer compound, and the solder paste is different from the heat will be cured, its freezing point temperature is 150℃, at this time, the red glue begins to become a paste directly into a solid.