bonding, that is, chip wiring, chip coating, also known as Bonding. bonding is a way of wiring in the chip production process, which is generally used to connect the internal circuit of the chip with a gold wire and the package pin before packaging, and generally after bonding (that is, after the circuit and the pin are connected), the chip is packaged with a black colloid, and the advanced external packaging technology COB(ChipOnBoard) is adopted. The process of this process is to implant the tested epitaxial sheet onto a special circuit board, and then connect the epitaxial sheet circuit to the circuit board with a gold wire, and then cover the melted organic material with special protection function on the epitaxial sheet to complete the later encapsulation of the chip.
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bonding technology advantage
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1, bonding chip anti-corrosion, seismic, stable performance.
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The advantage of this packaging method is that the stability of the finished product is much higher than that of the traditional SMT patch method, because the SMT patch technology widely used at present is to weld the pin of the chip on the circuit board, this production process is not suitable for the processing of mobile storage products, and there are problems such as virtual welding, false welding, and missing welding in the packaging test. In the daily use process, due to the long-term exposure of the solder joints on the circuit board to the air by moisture, static electricity, physical wear, acid corrosion and other natural and human factors, resulting in short circuit, break, and even burn. The bonding chip connects the internal circuit of the chip to the package pin of the circuit board through a gold wire, and then is accurately covered with organic materials with special protection functions to complete the post-packaging. The bonding chip is fully protected by organic materials and isolated from the outside world, and there is no moisture, static electricity, and corrosion. At the same time, the organic material melts through high temperature, covers the chip after drying by the instrument, and seamlessly connects with the chip, completely eliminating the physical wear of the chip, and has higher stability.
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2. bonding chip is suitable for mass production
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bonding technology is currently only mastered by a few large epitaxial film factories, and the number of slices will not be less than 100,000 or even higher. Its production process is safe and stable, almost no product quality problems, and the consistency of the product is strong, long service life. Therefore, large factories with technical strength will adopt this advanced but high research and development cost production process to process high-end products.
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The application of bonding technology
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In fact, bonding technology has been widely used in our side, such as mobile phones, PDAs, MP3 players, digital cameras, game consoles and other equipment LCD screens, many are the use of bonding technology. Therefore, the products purchased after the international factory bonding are relatively good in quality, performance and specifications. In the increasingly high operating frequency, the mask of the electromagnetic interference requirements of the equipment, the use of traditional packaging will be difficult to avoid some technical risks, bonding technology is an effective solution to improve.
WiFi Bonding(also known as band aggregation) improves data transmission rate and stability by using multiple transmission circuits, such as multiple WiFi networks and 4G networks. The WiFi Bonding module is used to consolidate traffic from multiple wireless sources into a single, bandwidth-scalable connection to increase overall throughput.
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Specifically, WiFi Bonding transmits data over multiple wireless network connections simultaneously, resulting in faster download speeds and better network connectivity. When the wireless network has delay or unstable connection, WiFi Bonding technology can seamlessly switch between multiple signals to ensure a more stable network connection.
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The WiFi Bonding module is mainly used in wireless applications, such as video production, live broadcasting, and online games, to improve the transmission speed and quality of images and data.