The common quality problems of SMT patches are missing parts, side parts, turning parts, offset, damaged parts, etc
First, the main factors leading to patch leakage:
1, component feed rack feed is not in place;
2. The gas path of the component nozzle is blocked, the nozzle is damaged, and the height of the nozzle is incorrect;
3, the equipment of the true air path failure, blockage;
4, the circuit board is poorly purchased, resulting in deformation;
5. There is no solder paste or too little solder paste on the solder pad of the circuit board;
6, component quality problems, the thickness of the same variety is inconsistent;
7. There are errors and omissions in the calling program of the chip mounter used in chip processing, or the selection of component thickness parameters is wrong during programming;
8, the human factor accidentally touched.
Second, the main factors that lead to the flip and side parts of SMC resistor mounting:
1, component feeding rack (feeder) feeding abnormal;
2, the mounting head of the suction nozzle height is wrong;
3, the height of the mounting head grab material is not right;
4. The charging hole size of the component braid is too large, and the component turns over due to vibration;
5. The direction of the bulk material is reversed when it is put into the braid.
Third, the main factors that lead to the offset of the component patch:
1. During programming, the X-Y axis coordinates of the components are incorrect;
2. The patch suction nozzle causes the suction to be unstable.
Four, the main factors that lead to the damage of the component patch:
1. The positioning thimble is too high, so that the position of the circuit board is too high, and the components are squeezed when mounting;
2, when the chip machine programming, the Z-axis coordinates of the components are not correct;
3. The nozzle spring of the mounting head is stuck.
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