1, can use automatic test probe station, automatic sorting machine (manipulator), automatic test equipment (ATE) and other related instruments and equipment, engaged in various integrated circuit testing.
2, do chip design, choose microelectronics microelectronics, integrated circuit design, manufacturing and application as the representative of the discipline, is one of the most rapid development of modern high-tech applied disciplines.
2, mainly test the voltage, wavelength, brightness, can meet the normal shipping standard parameters of the wafer to continue to do the next step, if the nine-point test does not meet the relevant requirements of the wafer, it is put aside for other processing.
3, chip inspection microscopy: whether there is mechanical damage on the surface of the material and pitting pits (lockhill) chip size and electrode size meet the process requirements whether the electrode pattern is complete expansion because the LED chip is still arranged closely after the slice is very small (about 0.1mm), is not conducive to the operation of the post-process.
4, directly use the DC voltage file, measure its output voltage to the LED light group, the corresponding DC voltage is proved to be good, no bad (see LED is series or parallel, an ordinary LED is calculated by 3 volts). Multimeter to measure led ballast.
5. Electron microscope: used to detect the microstructure and defects on the surface of Miniled chip. Color difference meter: Used to detect the color coordinates and color temperature and other parameters of Miniled products to ensure the stable color quality of products.
1. First throw the money in and turn the wheel. Secondly, when you stop, if the three turntables meet certain requirements, you can make money. After placing the bet, shoot the "SPIN" and wait to see the result of the pattern on the top.
2. Slot machines are a kind of entertainment equipment, usually used for gambling. It consists of a machine consisting of a large number of wheels and a set of levers. Slot machines originated in the United States and were widely used in casinos and arcades before being introduced to gaming markets around the world.
3, a gambling machine with small change. slot machine (foreign name: slot?The machine is a machine for gambling with loose change, named for the chip with a tiger on it. "Slot machine" is also known as "corner machine", its full name is "corner slot machine". 4. Slot machines are one of the simplest games in casinos, which is one of the reasons why they are so popular in both real casinos and online gaming halls. Players don't need to know any rules or technology to enjoy themselves. However, with a little guidance, the player might be able to pick it up faster.
5, What is the slot machine slot machine has 3 glass frames, there are different patterns inside, playAfter the coin is inserted, pull down the pull bar, it will start to turn, if a specific pattern will spit money out, the more the same pattern appears, the more money will be spit out.
6, game currency investment: Players first need to use in-game currency to make bets. This is usually earned by buying in-game coins, or by completing in-game missions. When betting, players can choose different amounts to invest in order to strive for higher returns.
1, semiconductor packaging test equipmentThe standby is a device used to Test and package semiconductor chips, and usually includes the following: Test Handler: used to test and classify chips, usually including components such as test heads, probe cards, and robotic arms.
2, welding machine: welding machine is used to connect the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding. Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. This device can simulate the stress and temperature environment in real use.
3, the main semi-derivativeBulk packaging test equipment includes: thinning machine. Thinning machine is to thin the wafer substrate by thinning/grinding, improve the chip heat dissipation effect, thinning to a certain thickness is conducive to the later packaging process. Four probes.
4, Photolithography Equipment: used to define and manufacture tiny circuit patterns on the chip, usually used in the initial stage of manufacturing the chip. Cleaning Equipment: used to clean and purify the surface of the chip to ensure good welding and packaging quality.
5, common semiconductor packaging equipment includes: chip sorter: used to separate the chip from the wafer. Pad preparation equipment: a pad for preparing chip connections, including a spherical pad preparation equipment and a flat pad preparation equipment.
6, microscopic imaging equipment: mainly including optical microscope, scanning electron microscope, etc., for the observation and analysis of material microstructure images. Chemical analysis equipment: mainly includes electron probe, energy spectrometer, Raman spectrometer, etc., used for chemical composition detection and analysis.
In the bright star of semiconductor equipment, the back-channel sealing equipment is like a bright pearl, driving the precision process of chip manufacturing. These devices cover both packaging and testing, and the key equipment in each link is constantly improved in precision and process innovation.
Welding machine: The welding machine is used to attach the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding. Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. thisThe device can simulate the stress and temperature environment in actual use.
Semiconductor packaging equipment generally have solder paste printing machine, solid crystal machine, reflow welding, light detection, repair equipment, etc., among which the most core is solid crystal machine, our company's production line is Zhuoxing Semiconductor solid crystal machine, very easy to use, the performance is very powerful.
Semiconductor production equipment: the core force driving the scientific and technological revolution Semiconductor special equipment plays a vital role in today's scientific and technological field, it is like the engine of the industry, promoting the vigorous development of the entire industrial chain. This sophisticated ecosystem can be divided into two main groupsKey stages: front wafer manufacturing and back package testing.
Semiconductor packaging equipment: benefit from downstream expansion, advanced packaging development and chip complexity, the boom is up 1) Semiconductor packaging equipment in 2017 global sales of nearly $6 billion, an increase of 3%. From the trend point of view, it is expected to start a new round of business cycle and further growth in the next 2-3 years.
The front path is mainly lithography, etching machine, cleaning machine, ion implantation, chemical mechanical flat and so on. The back channel mainly has the hitting line, Bonder, FCB, BGA planting, inspection, testing and so on. It is divided into wet process and dry process.The wet process is mainly a process involving liquids, such as cleaning, electroplating, etc.