Test Handler: Used to test and classify chips, typically including components such as test heads, probe cards, and robotic arms. Wire Bonder (Wire Bonder) : Used to connect the chip to the pin of the package device, usually using gold or copper wire for connection.
Microscopic imaging equipment: mainly includes optical displayMicromirror, scanning electron microscope, etc., used for the observation and analysis of material microstructure images. Chemical analysis equipment: mainly includes electron probe, energy spectrometer, Raman spectrometer, etc., used for chemical composition detection and analysis.
Welding machine: The welding machine is used to attach the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding. Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. This device can simulate the stress and temperature environment in real use.
The main semiconductor packaging and testing equipment includes:A thinning machine. Thinning machine is to thin the wafer substrate by thinning/grinding, improve the chip heat dissipation effect, thinning to a certain thickness is conducive to the later packaging process. Four probes.
Semiconductor devices are electronic devices made of semiconductor components. Semiconductor equipment includes laser marking machines, laser inkjet printers, packaging machines, water purifiers, etc. A semiconductor is a material with an electrical conductivity between a conductor and an insulator at room temperature. It is widely used in semiconductor radio, television and temperature measurement.
1, the life of the golden finger of the semiconductor test sorting machine is usually affected by the following factors: working environment: The working environment of the golden finger of the semiconductor test sorting machine is usually harsh, such as high temperature, low temperature, humidity, corrosion and other environments will cause corrosion and wear of the golden finger, thus affecting its life.
2, the use of good deionized water, regular replacement. The temperature control accuracy is best within plus or minus 0.3, so that the performance of the semiconductor laser is stable.
3, this length is not too precise research, there is no problem for 10 years, but it is the whole halfThe life of the lens and mirror in the conductor laser is not so much. Therefore, it should be concerned about the life of other lenses and galvanometers and the power protection of semiconductor lasers.
4, electronic components also have a life. The life of electronic components is not only related to its own structure and properties, but also closely related to its use environment and its role in the circuit.
Annual global semiconductor materials market salesThe SEMI report states that the global semiconductor materials market sales were $52.2 billion in 2019, down slightly -1%. According to SEMI, overall spending is expected to decline by 13% in 2018H2 and 16% in 2019H1, and fab equipment spending will increase significantly in 2019H2.
ASMP (052HK) : the world's leading semiconductor packaging equipment, product advantages are obvious. 2) Teredal (TERE.N) : the global leader in semiconductor test equipment, with a market value of about 55 billion yuan. 3) Japanese Edwan (685T) : Japan semiconductor test equipment leader.
Infineon drives global performance improvements in discrete devices. Global discrete semiconductor devices were born in the middle of the last century. In the 1950s, power diodes and power triodes were introduced and used in industrial and power systems. In the 1960s and 1970s, thyristors and other discrete devices developed rapidly. In the late 1970s, flat-power MOSFETs were developed.
Epitaxial sheet and chip are two key elements in the semiconductor manufacturing process, and their differences are mainly reflected in the manufacturing process and the purpose of use. Epitaxy refers to the technique of growing the same or different single crystal films on a single crystal substrate.
① Differences in material sources Taking silicon technology as an example, the whole silicon wafer is generally called wafer, and each unit will be sliced and packaged after the process. The bare piece of a single unit before encapsulation is called a die. chip is a generic term for a chip, sometimes referring to a packaged chip.
Semiconductor noThe equipment is constantly improved in precision and process innovation.
2, welding machine: welding machine is used to connect the chip to the packaging material. This device can be welded using hot pressing or ultrasonic welding. Fatigue tester: Fatigue tester is used to test whether the chip will fail after a long time of use. This device can simulate the stress and temperature environment in real use.
3, semiconductor packaging equipment generally has solder paste printing machine, solid crystal machine, reflow welding, light detection, repair equipment, etc., the most core is solid crystal machine, our company's production line is Zhuoxing SemiconductorSolid crystal machine, very easy to use, performance is very powerful.
4, semiconductor production equipment: the core force driving the scientific and technological revolution Semiconductor special equipment plays a vital role in today's field of science and technology, it is like the engine of the industry, promoting the vigorous development of the entire industrial chain. This sophisticated ecosystem can be divided into two main phases: front wafer manufacturing and back package testing.
5, semiconductor sealing equipment: benefit from downstream expansion, advanced packaging development and chip complexity, boom upward 1) Semiconductor sealing equipment in 2017 global sales of nearly 6 billion US dollars, an increase of 3%. From the trend point of view, it is expected to start a new round of business cycle and further growth in the next 2-3 years.
6, the front path is mainly lithography, etching machine, cleaning machine, ion implantation, chemical mechanical flat and so on. The back channel mainly has the hitting line, Bonder, FCB, BGA planting, inspection, testing and so on. It is divided into wet process and dry process. The wet process is mainly a process involving liquids, such as cleaning, electroplating, etc.
Common semiconductor packaging equipment includes: chip sorter: withTo separate the chip from the wafer. Pad preparation equipment: a pad for preparing chip connections, including a spherical pad preparation equipment and a flat pad preparation equipment.
Semiconductor packaging devices are devices used to encapsulate a finished Integrated Circuits (ICs) chip, attach the chip to the substrate, and provide protection, connectivity, and heat dissipation.
Welding equipment: Used to attach semiconductor chips to package substrates or lead frames. Common welding techniques include Wire Bonding,Flip Chip Bonding and Die Attach, etc.