pcb washing process
rough shape cutting
drilling
Drilling and removing glue, sinking copper
Objective: Copper deposition is to deposit a thin layer of copper on the insulation hole wall by chemical method. Process: rough grinding → hanging plate → automatic copper sinking line → lower plate → Dipping % dilute H2SO4→ thickening copper.
Removal of fronting and copper deposition, pattern transfer
Purpose: Graphic transfer is the transfer of the image on the production film to the board. Process: (blue oil process) : grinding plate → printing the first side → drying → printing the second side → drying → explosion → impact → check; (dry film process) : hemp board → film pressing → static → alignment → exposure → static → impact → inspection