1, dust control: the PCBA board should be stored in a relatively clean environment to avoid dust and foreign matter entering, causing pollution and damage to the circuit board and components. mayUse airtight bags or airtight containers to protect the board from dust intrusion.
2, by adjusting the PCB layout and wiring, ESD can be well prevented. Here are some common precautions. Use as many layers of PCB as possible, compared with double-sided PCB, the ground plane and power plane, as well as the closely arranged signal line-ground spacing can reduce the common mode impedance and inductive coupling, so that it can reach 1/10 to 1/100 of the double-sided PCB.
3, PCB design, for the protection of static electricity, generally use isolation, enhance the static immunity of the board and the use of protection circuit three measuresSet up anti-static circuit, there are a variety of mature design protection circuit at home and abroad, the highest electrostatic voltage of thousands of volts for effective protection. Protection circuits can reduce the sensitivity of components to ESD, but cannot completely eliminate it.
ESD (Electrostatic Protection Devices), also known as transient voltage suppression diode Array (TVS Array), It is a single or multiple ESD protection device designed by multiple TVS grains or diodes with different layouts to have specific functions.
Anti-static use more is ESD electrostatic protection diode; The circuit protection devices generally needed for surge protection are: TVS diode, TVS diode array (ESD electrostatic protector), varistor, self-restoring fuse, ceramic gas discharge tube, self-restoring fuse, semiconductor discharge tube, etc.
1, ESD (Electrostatic Discharge Protection DElectrostatic protection devices (evices), also known as transient voltage suppression diode arrays (TVS Array), are single or multiple ESD protection devices designed by multiple TVS grains or diodes with different layouts to have specific functions.
2. esd (Electro-Static discharge) is the full name of electrostatic impedance device. ESD is "a power type device structure inside the IC, placed near each pin, used to absorb electrostatic interference introduced into the chip from the external environment to the pin and prevent damage to the internal device."
3, electrostatic discharge, ESD (Electro-Static discharge), refers to the transfer of charge caused by objects with different electrostatic potentials close to each other or direct contact.
4, ESD (electrostatic discharge) damage and damage to electronic products have two kinds of sudden damage and potential damage. The so-called sudden damage means that the device is seriously damaged and the function is lost. This kind of damage can usually be found in the quality inspection during the production process, so the cost of rework and maintenance is mainly brought to the factory.
5, ESD (Electro-Static discharge means "Static discharge." ESD is a discipline formed since the middle of the 20th century to study the generation, harm and electrostatic protection. Therefore, the international custom will be used for electrostatic protection equipment collectively referred to as ESD, the Chinese name is called electrostatic impedance device.
6, ESD is a noun in the electronics industry, is the meaning of electrostatic discharge, electrostatic release. Electronic components, especially micro-electronic components, integrated circuit chips, etc., are threatened by anti-static electricity in the process of manufacturing, storage, and transportation, so the manufacturing of electronic products is completely excessiveThe process will be ESD control.
1, the number of cores: more cores can indeed obtain stronger multithreading capabilities, making the chip more flexible when performing tasks. Running frequency: The core frequency of the CPU will largely affect the speed of mobile phone operation, which is also an important reason for the mobile phone chip to increase the frequency.
2, area and integration: chip area: need to consider the physical size of the chip, usually the smaller the area, intoThe lower the cost, but also need to ensure the rationality of the layout, to avoid signal interference and electromagnetic interference.
3, physical limitations: the physical structure and material of the chip determine the upper limit of its performance. For example, the size and material characteristics of the transistors affect the power consumption, speed and heat dissipation of the chip. In addition, the interconnections between electronic components can also impose limits on signal transmission speed and power consumption.
4, chip utilization factors are as follows: chip performance is affected by chip architecture, manufacturing process, packaging, use environment and other factors, but the most important is the chip architecture and manufacturing process.
5, the production capacity of the chip burning day depends on a number of factors, such as equipment performance, production speed, the degree of automation of the production line and the yield in the production process. The following are some factors that can affect production capacity: Equipment Performance The performance of equipment directly affects production capacity.