1, wafer: refers to the silicon used in the production of silicon semiconductor integrated circuitsWafer, because its shape is round, it is called wafer; It can be processed into various circuit component structures on silicon wafers, and become IC products with specific electrical functions. The original material of the wafer is silicon, and the earth's crust is inexhaustible silica.
2, the chip is the semi-finished product of the wafer cutting. The chip is composed of more than N semiconductor devices. Semiconductors are generally diodes, transistors, field-effect tubes, low-power resistors, inductors and capacitors.
3, the chip is a name for the integrated circuit, and the chip is the substrate used to make semiconductor circuits. In actual business andp>wafer; It refers to the silicon wafer used in the production of silicon semiconductor integrated circuits, due to its circular shape. chip: chip; Is a general term for semiconductor component products. die: nude; It is a small unit in a silicon wafer that includes a single chip with a complete design and a portion of the slot area adjacent to the chip in both horizontal and vertical directions.
The wafer is the starting point of chip manufacturing. Wafer is a thin sheet of silicon substrate material used in the manufacture of integrated circuit chips. It is one of the basic materials for the manufacture of electronic devices and integrated circuits. The wafer is made of monocrystalline silicon material and hasIt has a flat surface and a highly pure structure.
1, the production process and principle of the chip are as follows: the production process of the chip is simply to deposit a layer of gold on a piece of glass, and then the part of this layer of gold is heated and melted and poured to the bottom of the substrate. And then an etching is done in this place, which is to carve an integrated circuit into this gold surface.
2, the production process of the chip is generally the preparation of semiconductor materials, wafer preparation, lithography technology, etching technology, cleaningWashing and testing; The principle is based on the theory of semiconductor properties. Production process: Preparation of semiconductor materials The materials for chip manufacturing are semiconductor materials, such as silicon, germanium, etc.
3, the same chip core can have different packaging forms, the reason is that the chip is fixed, the pin is bundled, and different packaging forms are made according to needs. For example: DIP, QFP, PLCC, QFN, etc., which mainly depends on the user's application habits, application environment, market shape and other peripheral factors.
4, the process of manufacturing a chip, in essence, is the process of realizing a transistor on a silicon material.
5, the raw material wafer of the chip, the composition of the wafer is silicon, which is extracted from quartz sand, and the wafer is the purified silicon element (9999%). Then, some of the pure silicon is made into silicon crystal rods, which become the material for the manufacture of integrated circuits in time semiconductors. Slicing them is a special requirement for chip manufacturing.
How many chips can a lithography machine produce in a day According to the ideal working state of the lithography machine, a lithography machine can be produced in a dayThe production of 800×600 chips, that is, 480,000 chips, excluding some of the defective products, the remaining day is about 400,000 chips, in years, there are about 461 chips. At present, the cost of a lithography machine up to hundreds of millions of dollars, and a lithography machine a year of production capacity of only a few, lithography machine is currently one of the world's most sophisticated equipment technology, and a 7-nanometer lithography machine is very expensive, the price of up to $200 million, or even $200 million lithography machine, is also in short supply.
According to the information on the Internet, a lithography machine takes about one dayIt can effectively manufacture about 600 chips, and it can manufacture almost 290,000 chips in a year. Why is the lithography machine so important? At present, whether it is mobile phone chips, automotive chips or other fields, including military, aerospace and other applications, chips are inseparable from lithography.
The ideal capacity of ASML's lithography machine, for example, can process 200 12-inch wafers per hour. However, the actual capacity is usually only 50% of the ideal capacity. In Huawei's 990 5G chip, for example, each chip has an area of 1,131 square millimeters, while a 12-inch wafer can provide about 600 coresPiece of raw material.
From the actual situation, the current order of asml has been scheduled to 2024, so it can be expected that the next few years of asml lithography machine will still maintain rapid growth. How many lithography machines does ASML sell to China? In the first quarter of 2022, asml sold a total of 62 lithography machines, including 59 new systems and 3 used systems.