The reason is that the SMT patch component side flip refers to the component is attached to the PCB corresponding pad, but the component lateral rotation of 90° or 180° this is the side stand, and the flip refers to the reverse side of the patch component and the front side down. These are because of the SMT mounter mounting failure, the following together with you to analyze the SMT mounter flip side causes and countermeasures.
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SMT mounter patch flip side stand reasons
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1, when the component thickness is set incorrectly, or is not in contact with the PCB pad and is put down, it is easy to cause side standing or flipping.
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2. When the chip placement machine picks up the chip, the pressure is too large, causing the feeder to vibrate, and the components in the hole under the braid will vibrate over.
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3. The vacuum of the mouthpiece of the SMT machine is opened or closed too early, causing the components to stand or turn over.
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4, the placement machine nozzle is worn or partially blocked, which will also cause the components to stand or flip.
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5, PCB deformation is serious, absolute depression of more than 0.5mm.
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In short, the components are side-standing and flipping, which are mainly related to the mounting process.
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What are the causes of SMT rollover and sidestand, and what are the countermeasures
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The SMT mounter should take corresponding measures according to specific reasons
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1, set the correct component height.
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2. Adjust the height of Z-axis pickup of the sticker head.
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3, adjust the nozzle vacuum opening or closing time.
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4. Check and maintain the nozzle regularly.
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5, do a good job of PCB support.
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The phenomenon of SMT patch flipping and side standing generally occurs on small-size chip components such as models 0603, 0402, and 01005.