The reasons for the poor uptake of the nozzle element of the placement machine are analyzed as follows:
First of all, components from the high-speed motion of the sticker head, removed from the packaging braid, affixed to the printed board in the process, will produce not taken, lost after absorption and other poor absorption failures, these failures will cause a large number of component losses, according to our experience, component absorption is usually caused by the following reasons:
First, the vacuum negative pressure is insufficient, when the suction nozzle takes the element, the suction nozzle produces a certain negative pressure, the element is adsorbed on the suction mouth, and the determination of whether the suction nozzle picks up the element is abnormal generally adopts the negative pressure detection method, when the negative pressure sensor detection value is within a certain range, the machine thinks that the absorption is normal, and vice versa. When the component is absorbed, the vacuum negative pressure should be above 53.33kPa, so that there is enough vacuum to absorb the component. If the vacuum negative pressure is insufficient, it will not be able to provide enough suction elements, in use, we should often check the vacuum negative pressure, and regularly clean the nozzle, but also pay attention to the pollution of the vacuum filter element of each mounting head, its role is to filter the air source that reaches the nozzle, and replace the black pollution to ensure the smooth flow of air.
Second, the nozzle wear, the nozzle deformation, blockage, damage caused by insufficient air pressure, resulting in suction components, so it is necessary to regularly check the degree of wear of the nozzle, the serious replacement.
Third, the influence of the feeder, the feeder feed is poor (the feeder gear is damaged), the material belt hole is not stuck on the feeder gear, there are foreign bodies under the feeder, the spring wear), the pressure belt cover plate, spring and other operating mechanisms produce deformation, rust, etc., resulting in component bias, vertical or unable to absorb the device, so it should be checked regularly, and the problem should be dealt with in time. So as not to cause a lot of waste of devices. Fourth, the influence of the height of absorption, the ideal height of absorption is to press down 0.05mm when the mouthpiece of the SMT machine touches the surface of the component, if the depth of the pressure is too large, it will cause the component to be pressed into the feed tank but can not take the material. If the absorption of a component is not good, the absorption height can be adjusted slightly upward, such as 0.05mm. In the actual work process, the author has encountered a bad suction of all components on a platform, and the solution is to appropriately move up the extraction height of the platform in the system parameters.
Five, the problem of incoming materials, some manufacturers produce chip components packaging quality problems, such as the hole spacing error is large, the adhesive force between the paper tape and the plastic film is too large, the size of the tank is too small, etc., are the possible reasons for the components can not be picked up.
The above is an analysis of why the nozzle element of the placement machine is not good when it is absorbed, and I hope it can help you!
SMT SMT machine normal operation, the nozzle does not bounce back, there are many kinds of this situation, such as the top height of the substrate, the nozzle blocked throwing material, the upper and lower is not flexible, the head back to the origin will jump head, view the head management page skip the head has a color prompt, each jump has a reason to prompt