Among semiconductor companies, several well-known companies with TSV technology include Intel, TSMC and Samsung Electronics. 1. Intel Corporation, one of the world's largest semiconductor companies, has invested a lot of research and development resources in TSV technology and applied it to its high-performance processor and chip packaging technology, which gives its products a competitive advantage in terms of performance and reliability. 2. TSMC is one of the world's leading semiconductor manufacturers and has extensive experience in TSV technology.
The company actively promotes the development of 3D chip technology and achieves higher integration and performance through TSV technology, meeting the market demand for smaller sizes and higher performance chips. Samsung Electronics, as a world-renowned manufacturer of semiconductors and electronic products, has also made important progress in TSV technology.
Its chips with TSV technology are competitive in the field of mobile devices and storage, providing users with faster data transfer speeds and higher storage capacity.
These companies have made important breakthroughs in the development and application of TSV technology, making their products have higher performance and competitiveness.
As far as I know, there are several companies in the semiconductor field using TSV (Through-Silicon Via) technology.
They include Intel, Taiwan Semiconductor Manufacturing and Samsung Electronics.
TSV technology is a method of connecting the inside and outside the chip through silicon perforation, which is often used in the manufacture of 3D integrated circuits.
The companies mentioned above are applying and exploring TSV technology in research and practice to improve chip performance and functionality.
It is important to note that industry development changes rapidly, and technological progress may vary.
With its professional leading packaging technology and excellent innovation strength, Taiwan's Infineon Semiconductor has the world's leading TSV technology, which can realize the stacking and interconnection of chips and chips, which can greatly improve the integration and performance of chips, but also reduce the size and power consumption of chips, which is an important trend in the future chip field. Infineon Semiconductor has made remarkable achievements in the related research and development and application of TSV technology, and its products are widely used in smart phones, automotive electronics, industrial automation and other fields.
Founded in 2003, Huatian Technology is one of the largest semiconductor packaging and testing manufacturers in China. It was listed on the Shenzhen Stock Exchange in 2007 (stock code: 002185), ranking 7th in the world and 3rd in China. Huatian Technology (Kunshan) Electronics Co., Ltd. is mainly engaged in large-scale semiconductor packaging, testing and module production, and owns six technical platforms: TSV, BUMPING, WLP, Fan-Out, FC, Test; With national postdoctoral workstation, Jiangsu academician workstation, is a key research and development institution in Jiangsu Province, Jiangsu TSV silicon through hole 3D packaging engineering technology Research center.
Huatian Technology (Kunshan) Electronics Co., LTD., a comprehensive layout of wafer-level advanced packaging technology, independent research and development of silicon based fan out packaging technology, silicon embedded system level packaging technology, 3D stacking technology, automotive electronics wafer-level packaging technology and other cutting-edge packaging technology, to reach the industry leading level.
Suzhou Keyang Company has tsv technology
Shuobide: The participating company Suzhou Keyang mainly uses TSV 3D packaging technology to engage in wafer-level packaging services for CIS chips and filter chips.
At present, many semiconductor companies around the world are researching and developing TSV (Through-Silicon Via) technology, including Intel, Samsung, TSMC, IBM, Infineon, Micron, and so on. TSV technology is a technology that connects different layers inside the chip through a vertical channel through the silicon chip, which can greatly improve the performance and integration of the chip. This technology can be applied in various fields, such as mobile devices, computers, medical devices, automotive electronics, etc.
Keyang owns many advanced sealing solutions such as TSV, Bumping, WLCSP, DPS, etc. The core technologies cover wafer bonding, wafer lithography, deep silicon etching, dielectric layer etching, etc. The main service products include image sensors, biometrics, RF filters, MEMS chips, etc. Widely used in consumer electronics, 5G communication, industry, medical, artificial intelligence, automotive electronics, industrial Internet and other fields.