Although the Kirin 9000S and Apple A14 are both processed by TSMC and the same 5nm process, the Kirin 9000S is not inferior to the Apple A14 in terms of performance. In the Geekbench 5-run test, KirinThe single-core score of the 9000S even exceeds that of the Apple A13, and the multi-core score is also comparable to that of the A13.
Huawei hisilicon's Kirin 9000 processor is only equivalent to Apple's A14. This is only in terms of performance, Kirin 9000 and Apple A14 are TSMC generation processing chips, which belong to the 5nm process.
The Kirin 9000s parameters are better than the Kirin 9000. The Kirin 9000s has a huge CPU performance improvement, almost surpassing the Apple A14. In the Geekbench5 test, the Kirin 9000s scored a single-core 1273, multicore 4324.
In fact, Huawei Hisilicon's Kirin 9000 processor can only be equivalent to Apple A13, and the performance is still slightly worse. Of course, this is only in terms of performance, Kirin 9000 and Apple A14 are TSMC generation processing chips, which belong to the 5nm process.
Kirin is an industry-leading smart phone chip solution with Huawei hisilicon's advanced SoC architecture and leading production technology. Kirin chip main high-end flagship models include Kirin 9000s, Kirin 9000 chip, Kirin 9000E chipKirin 990 5G chip, Kirin 990 chip, etc.
Kirin 9000S in the market in the upper middle level. The Kirin 9000S processor has been confirmed to adopt the hyperthreading design, with 8 cores and 12 threads, and the test tool has been adapted.
Although Huawei's Kirin chip may still have a gap in some aspects compared with international peers, Huawei's continuous research and development and innovation showThe possibility of catching up should not be underestimated. However, the fact is that China is more than 10 years behind the United States in core technology fields related to defense technology, such as commercial aircraft, semiconductors, biological machines, special chemicals and system software. Let me give you some examples. Take an example from the mobile phone industry. To sum up, I personally believe that it may take more than ten years for Mainland semiconductor to catch up with semiconductor.
1Domestic chip level can only achieve 90 nm. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm. High-end KrF and ArF photoresist are almost dependent on imports, of which ArF photoresist is almost zero domestic. At present, the manufacturing process level of China's chip has reached 14 nm, which can meet the needs of most application scenarios. In the future, China's chip manufacturing process will be further improved, is expected to 2025This year, the manufacturing process of chips in China will reach 7 nanometers.
3, China's domestic chip can reach 90 nm. Domestic chip level can only achieve 90 nanometers. From the perspective of chip manufacturing, equipment and materials such as lithography machines, etchers, wafers, and photoresist account for a large proportion. Among the lithographic machine equipment, the current Shanghai Microelectronics is 90 nm.
4, the Chinese lithography machine now reaches 22 nanometers. Before the breakthrough in microelectronics technology in Shanghai, China's domestic lithography machines have been stuck in the manufacture of chips with a 90nm process. This time, China has directly broken through from 90nm to 22nm