The reflectors of DFB lasers are composed of a special set of reflective refractive index, which can refract the output beam of the laser into a monochromatic laser beam. The mirror of the DFB laser can refract the output beam of the laser into a monochromatic laser beam, so that higher laser output power can be obtained.
For example, the light source of the entire fiber interconnection network is the Distributed Feedback laser (DFB, Figure 1, upper left), the early DFB laser adopts one-dimensional periodic grating structure for mode selection, but because there are two edge modes competing with each other, the single-mode output is not stable enough.
is a semiconductor laser with the simplest structure, the core part of which is a P-N junction, from which the laser is emitted. It cannot work continuously at room temperature, and only heterojunction semiconductor lasers can enter practical use. Note: The "junction" is made of a different semiconductor material.
1, the raw materials of single chip: the raw materials of chip production are mainlySilicon Wafer, which is a round sheet of high-purity silicon.
2, the composition of silicon is silicon, silicon is refined from quartz sand. Silicon wafers are purified by silicon elements (99.999%) and made into silicon rods, which become quartz semiconductor materials for manufacturing integrated circuits. A chip is a specific chip needed for chip manufacturing. The thinner the wafer, the lower the production cost, but the higher the requirements on the process.
3, the material of chip manufacturing is semiconductor material, such as silicon, germanium, etc. These materials need to be processed and treated in multiple steps before they become suitable for chip manufacturing.Wafers are the basis of chip manufacturing and are round sheets made of semiconductor material.
4, the raw material of the chip is the wafer, the composition of the wafer is silicon, silicon is refined by quartz sand, the wafer is the silicon element to be purified (9999%), and then these pure silicon into silicon rods, become the manufacture of integrated circuits. The ions are implanted in the wafer to generate the corresponding P and N class semiconductors.
Chip manufacturing process mainly includes wafer preparation, lithography, etching, ionSteps such as injection, film deposition, chemical-mechanical polishing, metallization, testing and packaging. These steps are linked together to ensure the high quality and performance of the chip. Detailed wafer preparation: Wafer is the basis of chip manufacturing, it is a round piece of silicon.
The pattern on the photomask is then transferred to the substrate through the etching process. The basic process of photolithography includes pretreatment, gluing, drying, exposure, development, hard film baking and etching.
. Package: After the chip is finished, it is packaged in a plastic or ceramic package for connection to a circuit board or other device. 1 TestDoes anyone know how chips are made? Can you tell me what you think? 1, first put the polysilicon into a special seal, unable to discharge all the air inside and heated to 1420 degrees Celsius, and then put the melted silicon into a rotating dry pan, and then put the equivalent of the size and shape of a pencil, rotating in the opposite direction.
2, the chip area should be in the center of the blue film, there are up to 5000 chips on the blue film, but it must be ensured that the number of chips on each blue film is not less than 1000, and the chip type, batch number, quantity and photoelectric measurement statistics are recorded in the labelOn the back of the waxed paper.
3, lithography technology is one of the core technologies of chip manufacturing, it can transfer circuit patterns on the chip to the wafer. Lithography technology requires the use of equipment and materials such as photolithography machines and photoresist. Etching technology Etching technology is a key step in transferring the circuit pattern on the wafer to the semiconductor material.
When the process comes to 5nm, the global chip business competition is more and more intense, the stronger the stronger. At present, the only chip designers that have released 4nm and 5nm processes are Mediatek, Apple, Qualcomm, Samsung and Huawei; Among manufacturing companies, the two most technologically advanced players, TSMC and Samsung, can produce chips with processes below 5nm.
At the bottom of information technology, the chip manufacturing process is like a sophisticated microcosm that determines the speed, efficiency and performance of the device. In simple terms, the process is the key step in semiconductor manufacturing, which determines the characteristics of the circuit, including the size and performance of the transistor.
The most complex and critical process step in chip manufacturing is lithography. Lithography is the process of transferring the circuit diagram from the mask to the silicon chip, and its technological level directly determines the process level and performance level of the chip.
1, reflow welding is to heat the component plate to melt the solder paste to achieve the electrical connection between the device and the PCB plate solder pad. Related equipment: reflow furnace.
2, the process of SMT patch processing is: solder paste mixing → solder paste printing →SPI→ mounting → reflow welding →AOI→ repair solder paste mixing: After the solder paste is taken out of the refrigerator and thawed, it is stirred by hand or machine to be suitable for printing and welding.
3, single-sided mixed (type II) surface mounted components and lead components mixed use, and type II is different from the printed circuit boardIt is a single panel.
4, circuit design skills PCB design process The general PCB basic design process is as follows: preliminary preparation -PCB structure design -PCB layout - routing - routing optimization and screen printing - network and DRC inspection and structure inspection - plate making. First: preparation. This includes preparing component libraries and schematics.
5, liquid crystal production process flow chart ● Through the front glass substrate/color filter substrate process to form a precise arrangement of color filter layer. ● Thin film substrate process to form thin film transistor liquid crystal (TFT) arrays and others for display pixel controlElectronic components.
6, PID diagram as the technical core of the factory production, whether it is the engineer of the design institute, the electrical technician, or the main operation of the central control room, understand the meaning of each letter and symbol on the PID diagram, and clearly understand the role of these components and control methods, is an essential skill as an electrical person.