In the critical step, once the process indicators run out of limit, the risk of chip manufacturing failure will be greatly increased.Therefore, the more advanced the process, the more to ensure the stability of the process.
Although chips can already be produced on such a large scale, producing them is not easy. The process of manufacturing a chip is very complex, and today we will cover the six most critical steps: deposition, photoresist coating, lithography, etching, ion implantation and packaging.Wafer preparation: Wafer is the basis of chip manufacturing, it is a round piece of silicon. In the preparation process, the silicon raw material goes through the steps of melting, purification, crystal pulling, cutting, etc., and finally gets a wafer with a specific diameter and thickness.
Then passIncluding: lithography, cleaning, etching, heat treatment, deposition, evaporation, line etching, copper coating, ablation, passivation layer etching, metal coating, heat treatment, cleaning, testing and other steps.
Mobile phone camera production process is divided into four parts, mainly modules, chips, testing, packaging. The composition structure of the mobile phone camera is mainly composed of lens group, infrared filter, voice coil, image sensor and module package.
Chip production process and principle are as follows: chip production processSimply put, a layer of gold is deposited on a piece of glass, and then part of this layer of gold is heated and melted and poured under the substrate. And then an etching is done in this place, which is to carve an integrated circuit into this gold surface.
The chip manufacturing process mainly includes wafer preparation, photolithography, etching, ion implantation, film deposition, chemical-mechanical polishing, metallization, testing and packaging. These steps are linked together to ensure the high quality and performance of the chip. Detailed wafer preparation: Wafer is the basis of chip manufacturing, it is a round piece of silicon.
The production process of the chipGenerally have semiconductor material preparation, wafer preparation, lithography technology, etching technology, cleaning and testing; The principle is based on the theory of semiconductor properties. Production process: Preparation of semiconductor materials The materials for chip manufacturing are semiconductor materials, such as silicon, germanium, etc.
1, wet wash (with various reagents to keep the surface of the silicon wafer free of impurities).
2, creativity and blueprint: the starting point of design First of all, the birth of the chip from the designer's innovative thinking. They follow the customerThe needs of the household, drawing a fine circuit diagram, the selection of 9999% pure silicon rod as a raw material, began the journey of creation of the micro-world.
3, the steps of chip manufacturing include sand and silicon separation, silicon purification, silicon casting into silicon ingots, wafer processing, lithography, etching and ion implantation, copper filling, gluing, and making another layer of structure. 1 Chip manufacturing requires 5,000 processes, involving more than 50 industries and 2000-5000 processes.