The following is the general history of Huawei chip research and development:
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1. Early stage (1991-2000) : Huawei began to enter the chip field in 1991, initially through cooperation with partners, foundry production of chips, rather than independent research and development. During this period, Huawei was mainly engaged in the construction of communications infrastructure.
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2. Independent Research and Development stage (2000-2012) : Since 2000, Huawei began to make breakthroughs in independent research and development of chips. They established Huawei Hisilicon Semiconductor Co., LTD. (now known as Hisilicon Semiconductor Co., LTD.), which focuses on the development and manufacturing of mobile communication chips. During this period, Huawei HiSilicon released a number of chip products, such as HiSilicon K3, K3V2, Kirin series, etc., and gradually realized its dependence on independent chips.
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3. Innovation and Breakthrough stage (2012 to present) : Since 2012, Huawei has continued to increase its investment in chip research and development, and is committed to achieving a true global leading position. Huawei has launched a series of advanced chip products, such as the Kirin processor series and Centeng AI chip series. These chips are competitive and influential in areas such as mobile phones, network devices, cloud computing and artificial intelligence.
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In general, after years of efforts and investment, Huawei has made great progress in the field of chip research and development, and gradually achieved independent innovation and technology leadership. They have built a complete ecosystem of chips on a global scale, including design, manufacturing, testing and production. Huawei chips are widely used in the mobile phone market, communication equipment and cloud computing, and have an important position in domestic and foreign markets.
The development of Huawei chips can be traced back to 2004, when Huawei began to enter the field of chip research and development. Initially, Huawei mainly relied on outsourcing and the introduction of technology for chip research and development, until 2007, Huawei began its own chip research and development road. After years of research and development, Huawei's chip products have gradually emerged in the market and achieved a series of important results. Today, Huawei has become one of the world's largest chip manufacturers, and its self-developed Kirin chip has become a leading brand in the industry.
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Huawei's chip development process is as follows:
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In 1993, relying on the EDA software purchased overseas, Huawei successfully developed SD509 supporting non-blocking slot exchange, and used it for the first digital programmable switch C& independently developed. C08, which later became one of the world's largest selling switches.
In 1995, Huawei Central Research Department was established, under the basic business department, to take over the research and development of communication system chips.
In 2004, Huawei decided to set up hisilicon Semiconductor, which started with digital security chips.
In 2009, it launched a one-stop solution for GSM low-end smart phones with a chip named K3V1, which opened a long road of exploration for mobile phone chips.
Since then, Huawei 2012 Laboratory was established, and Hisilicon belongs to the laboratory, but its status is equivalent to Huawei's first-level department.
After 30 years of hard exploration, Huawei has a total of five series of chips.