The hw4.0 chip was officially launched in August 2020. The hw4.0 chip is a super large HPC(high performance computing) chip developed for automobiles, which will be made of TSMC's 7nm process, and will be the first chip to use TSMC's SoW advanced packaging technology, each 12-inch wafer can be cut into 25 chips, and the new chip will be put into production in Q4, with an initial output of about 2000 wafers.