The thin film in the chip manufacturing process is the thin film deposition, which can be a semiconductor or a metal.
Thin film deposition is the plating of a film on the main substrate material of a semiconductor. This film can have a variety of materials, such as the insulating compound silicon dioxide, semiconductor polysilicon, metal copper, etc. Thin film deposition is one of the three core steps of semiconductor technology. Integrated circuit thin film deposition can be divided into physical vapor deposition (PVD), chemical vapor deposition (CVD) and epitaxy. PVD refers to physical processes such as atomic sputtering when the target surface is bombarded by particles through thermal evaporation, and is mostly used in metal deposition. CVD refers to the process of deposition of thin film on the surface of silicon wafer through the chemical reaction of gas mixing, which can be applied to the deposition of insulating film, polysilicon and metal film. Epitaxy is a process of growing a single crystal film on the surface of a silicon wafer in the direction of the substrate crystal.
Thin film in the chip manufacturing process refers to the packaging industry. Electronic packaging industry.