The Kirin 970's chip size is 9.75mm x 9.92mm = 96.72mm2, and the overall area is 18% smaller than its predecessor (10.77mm x 10.93mm = 117.72mm2). Thanks to the 10nm process, the large core area of the Kirin 970 is reduced by 38% and the small core is reduced by 25%. The size of the A73 core has been reduced from 1.37 mm2 to 0.83 mm2, which is excellent. Even with its exploding core GPU, the 12-core Mali-G72 is 19% smaller than its predecessor, the six-core G71. What is most unexpected is that the NPU area highlighted in the conference is very small.
Other components include the new RF transceiver Hisilx Hi6363, which is also one of the secrets of Huawei's ability to achieve Cat 18\/Cat 13 speed. Mate10 there are Hi6421, Hi6422, Hi6423 a total of three power management chips, the previous generation of charging IC HisilIC Hi6523 retained, in addition to the motherboard also found Texas Instruments BQ25870.
1, Huawei Mate 10 chip Kirin 970.
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2, Kirin 970 not only in the performance and architecture has been greatly improved, but also for the first time to join the NPU(neural AI unit), breaking the conventional mobile phone chip CPU GPU fixed combination. NPU heterogeneous computing architecture HiAI will greatly improve the computing speed of Huawei Mate 10 for AI tasks.
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3, the same AI application task, Kirin 970 is 25 times faster than ordinary chips. Specifically for tasks such as image recognition, the Kirin 970 recognition speed is 2005 images\/minute, while the Snapdragon 835 chip Samsung Galaxy S8 only 95 images\/minute.