Refers to patch components
SMT patch introduction
SMT patch refers to a series of processes on the basis of PCB. PCB (Printed Circuit Board) means printed circuit board. (Original: SMT patch refers to the short term PCB (PrintedCircuitBoard) for a series of process processes processed on the basis of PCB)
SMT is the Surface assembly Technology (Surface Mounted Technology) (short for Surface Mounted technology), is currently the most popular technology and process in the electronic assembly industry. Electronic circuit Surface Mount Technology (SMT), known as surface mount or surface mount technology. It is a pin-free or short-lead surface assembly component (referred to as SMC\/SMD, Chinese called chip components) installed on the surface of the Printed Circuit Board (PCB) or other substrate surface, by reflow welding or dip welding and other methods to weld the circuit assembly technology.
Under normal circumstances, the electronic products we use are all designed by pcb plus a variety of capacitors, resistors and other electronic components according to the design of the circuit diagram, so all kinds of electrical appliances need a variety of different smt patch processing technology to process.
SMT basic process elements: solder paste printing --> Parts mounting --> Reflow welding --> AOI Optical Inspection --> Maintenance --> Split board.
Some people may ask why it is so complicated to connect an electronic component? In fact, this is closely related to the development of our electronics industry, today, electronic products pursue miniaturization, and the previously used punch plug-in components can not be reduced. The function of electronic products is more complete, and the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, and surface patch components have to be used. Product mass, production automation, manufacturers to low cost and high output, produce high-quality products to meet customer needs and strengthen market competitiveness The development of electronic components, integrated circuit (IC) development, semiconductor materials multi-application. The revolution of electronic science and technology is imperative, and the pursuit of international trends. It can be imagined that in the case of intel,amd and other international cpu, image processing device manufacturers of the production process to more than 20 nanometers, the development of smt this surface assembly technology and process is also necessary.
The advantages of smt chip processing: high assembly density, small size and light weight of electronic products, the volume and weight of the chip components are only about 1\/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%. High reliability and strong vibration resistance. Low defect rate of solder joint. Good high frequency characteristics. Reduced electromagnetic and radio frequency interference. Easy to automate and improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc.
A chip with 100 written on the circle is usually a capacitor. A capacitor is a passive component used to store charge, which can be stored in a medium between two conductor plates. In circuits, capacitors are usually used in circuits such as filtering, coupling, decoupling, and voltage regulation.
On a chip capacitor, 100 usually means that its capacitance value is 100 PF (skin method). Of course, it may also be other units, such as 100nF (nanomethod) or 100μF (micromethod), which needs to be determined according to the specific component model and specification.