Chip sealing is the use of thin film technology and fine processing technology, the chip on the substrate layout, fixed and connected, and plastic insulating media filling sealing to form electronic products, the purpose is to protect the chip from damage, to ensure the heat dissipation performance of the chip, and to achieve the transmission of electrical energy and electrical signals, to ensure the normal operation of the system. Semiconductor testing is mainly to test the appearance and performance of the chip. In the semiconductor industry, integrated circuit (IC) sales accounted for more than 80%, after years of development, has changed from the initial IDM mode to \"IC design silicon manufacturing IC manufacturing IC sealing\" division of labor, which is an indispensable part of the semiconductor industry chain.
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The technical content of closed test is relatively low, and domestic enterprises first enter the integrated circuit industry with this as the entry point. In recent years, domestic closed test enterprises have obtained good industrial competitiveness through epitaxial expansion, and their technical strength and sales scale have entered the world's first echelon. Under the general trend of the transfer of chip manufacturing capacity to the mainland, mainland sealed test enterprises have seized the share of Taiwan, the United States, Japan and South Korea sealed test enterprises. In 2018, the three domestic sealed test giants Changdian Technology, Huatian Technology and Tongfu Micro Electricity ranked third, sixth and seventh in the global industry.
Compared with chip design and manufacturing, the technical content is lower.
However, as the wafer foundry process continues to shrink and Moore's law approaches its limit, advanced packaging is the inevitable choice in the post-Moore era, including flip, wafer-level packaging, fan-out packaging, 3D packaging, system-level packaging and so on. Advanced packaging will redefine the position of packaging in the semiconductor industry chain, and the impact of packaging on chip performance will increase.
The semiconductor industry is still in an upward cycle, sealed test capacity is in short supply, and advanced packaging is an inevitable choice in the post-Moore era.
From the perspective of China, the sealed test link is the strongest part of the semiconductor industry chain, with international competitiveness, and advanced packaging creates more value for the semiconductor industry, and the power of the sealed test enterprise and the industrial status are improved, thus increasing profits.