First, by definition, the laser chip is also a laser. Laser chip is generally injected by current, when the injection current > When the threshold current is set, the laser of a specific band can be emitted;
Second, from the type of division, the laser chip is divided into 2, VCSEL and edge emission EEL:
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Vcsels are classified as follows:
The advantages of the VCSEL laser are a narrow line width (0.35nm) and a small wavelength shift to temperature (0.06nm \/℃). In addition, the threshold current of the VCSEL laser is also small (1mA), at the same output power, it is more efficient than the DFB laser and the FP laser, and it is not as easy to chirp as the DFB laser. Therefore, even data with a speed of 10Gbps can be directly modulated by VCSEL laser. Finally, it is easier to manufacture and adjust collimated VCsels than other lasers, making it possible to produce low-cost VCSEL-based transceivers. These features appear to be sufficient to make VCSEL an ideal solution for high-performance communications applications. Among them, 850nm VCSEL has been applied on a large scale, but because of the shortcomings of long wavelength (1310nm, 1550nm) VCSEL, such as insufficient output power and complex manufacturing process, it has not been applied on a large scale.
Edge-emitting lasers can achieve greater power than VCsels. For FP lasers, transverse mode control is relatively easy to achieve, by controlling the thickness of the active layer (figure 0.1um) and strip width (figure 200um), commonly used structures are buried heterojunction, ridge waveguide and so on; In a common edge-emitting FP laser, multiple longitudinal modes can be observed when the injection current is near the width current Ith. When the current is further increased, a certain wavelength at the peak of the spectrum is lapped first, which consumes most of the carriers, suppresses other modes of lasing, and may form a single longitudinal mode operation. When the FP laser is modulated at high speed, the original lasing mode will change and multi-mode operation will appear. Therefore, FP lasers are not suitable for high-speed long distance fiber optic communication systems. However, its structure and production process are the simplest, the cost is the lowest, and it is still widely used.
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Many applications are as follows:
Laser chip is an important component which can convert electrical energy into light energy and realize laser amplification through light intensity amplification. Laser chips are usually made of semiconductor materials, such as gallium arsenide (GaAs) and gallium arsenide (InGaAs). Laser chip is one of the most critical components of laser, and its quality and performance have a huge impact on the overall performance and application range of laser.
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Laser chips are generally divided into two categories: boundary emitting laser chips and vertical cavity surface emitting laser chips. Among them, the structure of the boundary emitting laser chip is simple, easy to manufacture and integrate, which is suitable for the production of low power laser, but the optical mode is relatively wide, the light intensity distribution is not uniform, and the high threshold current limits the output power improvement. The VCC chip structure is more complex, but the optical mode is more single, the light intensity distribution is uniform, the threshold current is low, and the output power and energy efficiency are higher.
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Laser chips usually require high-precision manufacturing and testing, and have a very wide range of applications, such as communications, laser manufacturing, medicine, instrumentation, and so on. Common lasers include laser Pointers, laser cutting machines, fiber lasers and semiconductor lasers.
The laser chip is the core component of the laser, which refers to the chip part that converts the energy of the laser into the laser beam.
It is generally made of semiconductor materials, such as GaAs, InP, etc., with high photoelectric conversion efficiency, peak power and high reliability.
The quality and manufacturing process of the laser chip have a crucial impact on the performance and life of the laser. The research and application of laser chip has been very extensive, involving such as communication, manufacturing, medical and other fields. Such as optical fiber communication, laser printers, medical laser surgery instruments, etc., their performance and effect depend on the quality and design of the laser chip. Therefore, the research and development of laser chips is very important.
Laser chip, by definition, laser chip is also a laser. The Laser chip, a tiny silicon chip developed by Caltech called nanophotonic coherent imager (NCI), uses an array of LIDAR (a type of liDAR used for light detection and ranging) sensors that are similar to LiDAR and can sense the distance and size of an object. Incorporating this technology into a one-square-millimeter chip, implanted in a mobile phone is no longer a dream.
A laser chip is also a laser. Laser chip is generally injected by current, when the injection current > When the threshold current is set, the laser of a specific band can be emitted; In terms of types, laser chips are divided into two types, VCSEL and edge-emitting EEL.
The reliability of the laser chip is a very key index, whether it is a low-power laser pointer or a laser communication chip with high requirements, it is necessary to carry out the aging and reliability test of the chip.
Compared with traditional electronic chips, laser testing is more complex, involving light and electrical measurement, but also to consider the difference in packaging forms. Aging test is as a means of testing the chip, in the early stage of research and development, you can also get a lot of chip quality information through the chip aging test, you can find some early process problems.
Laser chip is a miniaturized laser emitter, generally made of semiconductor materials, which can convert electrical energy into laser energy. It has the advantages of low power consumption, small size, high luminous efficiency, and can be used in laser printing, laser cutting, laser display and other fields.