IGBT packaging process generally includes the following steps:
< br >
1. Wafer cutting: The wafer is cut into a single chip, usually using a cutting disk and offline cutting machine.
< br >
2. Back treatment: Polish and cure the electrode silver paste on the back of the piece to prevent leakage.
< br >
3. Front processing: corrosion, cleaning, lithography and other processing processes are carried out on the front of the chip to produce metal electrodes, silicon carbide materials and other structures.
< br >
4. Binding: The chip and the radiator are bound together, usually using heat-conducting glue or welding.
< br >
5. Cable welding: Paste wires on the chip and use the welding process to realize the connection between the external pins and the chip.
< br >
6. Test and sort: test and sort all prepared IGBTs, detect their performance and electrical characteristics, and assign a suitable number to each device.
< br >
7. Package and package test: Put all IGBTs into the package box and use automated equipment to complete the packaging process. After completion, package test is carried out to ensure that the appearance quality meets the requirements.
,
The above is the general process of IGBT packaging process. There may be some specific differences between different manufacturers, but in general, it is done according to the above combination of steps.
IGBT packaging process includes the following steps: 1. Preparation of the chip: including chip removal of impurities, thinning, corrosion, cleaning and other steps; 2. Welding: Welding the chip with the lead and other components, including spot welding, wave soldering, reverse welding, etc.; 3. Conductive adhesive: coating conductive adhesive around the chip for electrical connection of the chip after packaging; 4. Encapsulation: Apply sealant on the bottom of the conductive adhesive, and then cure and package the conductive adhesive and sealant through the oven or vacuum injection molding machine, and finally get the packaged IGBT module; 5. Post-processing: Post-processing of the packaged module, including cutting, polishing, labeling, testing and other steps.
Because the IGBT module needs to have high electrical performance and reliability, the IGBT packaging process is relatively complicated and complex, and every link needs to be strictly controlled to ensure that the final packaged module can meet the application needs.
The packaging process includes the following steps: welding foot production, chip cutting, bonding, silver paste printing, ball grid, shape refinement, testing, etc.
All of these steps need to be performed strictly and carefully.
Because the quality of the packaging process is directly related to the performance of IGBT products.
The above is a simple description of the IGBT packaging process.
In addition, the IGBT packaging process also varies slightly with IGBT devices of different sizes and functions, depending on the actual situation.
IGTA packaging process requires a high technical level and strict implementation process, but also inseparable from the support of advanced packaging process equipment, the key points of the process is the strict implementation of the steps and the coordination of a number of key processes to ensure the quality and stability of the final packaging product.
igbt chip manufacturing process:
< br >
1. Pre-finishing grinding: wash and clean the raw material wafer, grinding to remove surface contamination.
< br >
2. Wafer fusing: The raw material wafer is divided into many small pieces in order to better fuse into the appropriate size.
< br >
3. Coating thick film: Coating the film with accurate thickness, controlling the thickness and appearance of the layer.
< br >
4. Corrosion: passivation corrosion to remove excess film layer.
< br >
5. Lithography: Etching specific shapes and patterns on the wafer surface.
< br >
6. Gold plating: Add a thin film on the wafer surface to improve its electrical conductivity.
< br >
7. Burn: Burn the circuit on the wafer to complete the final circuit design.
< br >
8. Test: The wafer performance test and inspection.
< br >
9. Package: Package the wafer to make it a usable integrated circuit product