Tungsten is commonly used to produce ultra-small tungsten oxide films due to its high purity (greater than 99.95%), high density (19.35g\/cm3), low vapor pressure, low evaporation rate, and good high temperature resistance.
For the current hot semiconductor chips, the new tungsten oxide film can be very good as its diffusion barrier layer, bond layer and large integrated circuit memory electrode, which can significantly improve the overall quality of chip products.
Tungsten is a highly conductive metallic element that is often used in semiconductor manufacturing as a filler for through holes (Via) and vertically contacted Contact holes (Contact) between metal layers.
Chip hardness and conductivity flexibility!