BGA thickness refers to the thickness of ball grid array (BGA) chip components. BGA chip assembly is an packaging technology that connects a chip to a PCB (printed circuit board). It usually consists of a plastic shell and a set of welding balls, which are welded to connect the chip to the PCB.
The BGA thickness can be determined by the thickness of the plastic housing of the chip component, the height of the solder joint ball, and the clearance between the bottom PCB and the chip component. Typically, BGA is between a few hundred microns and a few millimeters thick. The proper design of BGA thickness is very important to ensure the normal connection and conduction of chip components, provide good thermal conductivity, and meet the size and weight requirements of electronic products.
BGA thickness refers to the height difference between balls in a ball grid array (BGA) package. It is determined by measuring the vertical distance between the substrate of the BGA package and the highest welding ball. Through machining and design control, BGA thickness can be controlled within precise ranges to ensure the reliability of welding and connections and to meet specific electronic device requirements. The exact definition of BGA thickness may vary by manufacturer and application.
The full name of BGA Ball Grid Array (ball array package), which is made at the bottom of the package substrate array welding ball as the I\/O end of the circuit and the printed circuit board (PCB) interconnect. The device packaged by the technique is a surface mount device.