Compatibility has no impact, FBGA is better than BGA package! This is an era that has been eliminated! The packaging methods of memory particles have gone through DIP, SIP, SOJ, TSOP, bga, CSP, and these have become history. fbga is a plastic package of bga= ball grid array packaging technology. The emergence of this technology has become the best choice for high-density, high-performance, multi-pin packages such as CPU, motherboard south and north bridge chips. However, the BGA package occupies a large area of the substrate. Although the technology has an increased number of I\/O pins, the distance between the pins is much greater than the QFP, which improves the assembly yield. Moreover, the technology adopts the controlled collapse chip welding method, which can improve its electric heating performance. In addition, the technology can be assembled by coplanar welding, which can greatly improve the reliability of the package; And the encapsulated CPU signal transmission delay realized by this technology is small, and the adaptation frequency can be greatly improved. BGA package has the following features: Although the number of I\/O pins is increased, the distance between the pins is much greater than that of QFP package, which improves the yield. Although the power consumption of BGA is increased, due to the controlled collapse chip method welding, the electric heating performance can be improved, the signal transmission delay is small, the adaptation frequency is greatly improved, and the assembly can be coplanar welding, and the reliability is greatly improved