Simply put, BGA is a chip packaging method that realizes the adhesion and conduction of integrated circuits through tin balls and flux, which is to realize the adhesion and signal conduction between the chip and the circuit board by using tin ball welding.
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Ball Grid Array (BGA) is a surface adhesive packaging technology used on integrated circuits to permanently secure devices such as microprocessors. BGA packages can accommodate more pins than other packages such as Dual in-line packages or Quad Flat packages, and the entire bottom surface of the device can be used as pins instead of only around it. It also has a shorter average wire length than the surrounding defined package type for better high-speed performance.
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Soldering BGA-packaged devices requires precise control and is usually done by automated plant equipment. The BGA package device is not suitable for slot fixation.
The full name of BGA is Ball Grid Array (ball array package), which is made at the bottom of the package substrate array welding ball as the I\/O end of the circuit and the printed circuit board (PCB) interconnect. The device packaged by the technique is a surface mount device.