1. Preparation for repair: For the BGA chip to be repaired, determine the air nozzle nozzle to be used.
2, set the welding temperature, and store it, so that it can be directly called when it is repaired in the future.
3. Switch to the disassembly mode on the touch screen interface, click the repair key, and the heating head will automatically come down to heat the BGA chip.
4. After the temperature curve of the repair table is completed, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck up the BGA to the initial position. The operator can connect the BGA chip with the material box. Desoldering complete. This is how to remove welding using BGA welding table. Mount welding, the use of welding method is not difficult. Generally, manufacturers will be equipped with instructions, and it is good to follow the instructions to operate, like Dezheng intelligent bga repair table usually has technical staff on-site guidance and teaching. Summary: Practice and think more, you will find that the use of BGA welding table is so simple.