BGA tin ball A special solder ball used on a tin plate before soldering BGA encapsulated integrated circuits. The specific method of use is to cover the solder paste coated with the newly bought chip with BGA tin net, put the BGA tin ball, blow it with a heat gun, and take out the BGA tin net after welding on the chip, and weld the BGA tin ball chip on the circuit board with the BGA welding table.
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The main uses of tin balls are widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, as well as the assembly of many groups of integrated circuits in the electronics industry, and also used in the determination of arsenic, phosphate reagents, reducing agents, tinning products.
High-quality BGA tin balls must have the characteristics of circularity, brightness, electrical conductivity and mechanical connection performance, small diameter tolerance, low oxygen content, and precision, advanced tin ball production equipment is the key to providing high-quality tin ball products. The design of tin ball production comes from Taiwan, where IC is developed, with advanced nature, high precision, high accuracy, manufactured by Taiwan professionals, and equipped with a variety of high-precision inspection instruments imported from Japan, Germany, the United States and Taiwan.