The BGA welding temperature setting is usually determined according to the requirements of the solder. In general, the commonly used BGA welding temperature range is between 200°C and 245°C. The specific temperature Settings depend on the welding process and the characteristics of the welding equipment. When setting the welding temperature, the following factors need to be considered:
1. Material temperature resistance of the BGA chip and substrate: Ensure that the welding temperature will not damage the BGA chip or substrate.
2. Melting point of solder: The melting point of solder should be lower than the welding temperature to ensure that the solder can be completely melted.
3. Temperature stability of welding equipment: Welding equipment should be able to stably control the welding temperature, and maintain a certain temperature uniformity. 4. Welding time: The setting of welding temperature should also consider the welding time to ensure that the solder can be fully melted and diffused.
It is recommended to perform some experiments to determine the optimal welding temperature and time before starting the formal welding. This can be tested by welding sample plates to find the most appropriate parameters.