Include the following points:
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1. Clean the surface: Before planting tin, the surface without steel mesh must be cleaned to ensure that there are no impurities or dirt. Anhydrous alcohol or other surface cleaners can be used.
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2. Choose the right solder: Choose a solder suitable for no steel mesh, you can use lead-free solder or other low temperature solder.
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3. Prepare the soldering iron: use the appropriate temperature of the soldering iron (usually 250-300 ° C), and then dip the iron with the right amount of solder.
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4. Tin planting technique: Apply the solder to the pad without steel mesh, and heat the solder with a soldering iron until the solder melts and connects to the pad. Avoid welding time too long, so as not to solder into other areas without steel mesh.
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5. Check welding: After the completion of tin planting, check whether the welding is firm, whether there is a short circuit of the solder joint or other problems. If there is a problem, it should be repaired in time.
Hello, BGA does not have steel mesh tin, so you need to use a ball setter or manually point tin. The specific steps are as follows:
1. Prepare the BGA chip and PCB board.
2. Prepare the solder paste and solder ball.
3. Apply solder paste to the ball position of the BGA chip.
4. Stick the solder ball to the position of the solder ball of the BGA chip with the ball row machine or manually.
5. Place the BGA chip on the corresponding position of the PCB board, paying attention to the correct direction and position.
6. Heat the BGA chip with a heat gun or electric soldering iron to melt the solder ball and connect it with the pad on the PCB board.
7. Check the solder joint quality after cooling. If there is any abnormality, reheat or replace the solder ball.
It should be noted that manual tinning requires skill and experience, and it is not recommended for beginners to try it on their own.
Hello, BGA no steel mesh tin can be through the following methods:
1. Manual tin spot: Using a manual soldering pen to apply the tin spot bit by bit to the BGA pad, which requires great care and patience.
2. Machine printing tin: Use automatic printing press to print solder paste, and print the solder paste evenly on the BGA pad.
3. Manual tinning by eye observation: This method requires experienced technicians to manually tinning, and adjust the speed and strength of manual tinning by observing the state of the pad and solder paste.
4. Watch the tin on the machine: Use the automatic tin machine to tin, and ensure the tin quality by observing the tin situation and adjusting the machine parameters.
Regarding this issue, BGA welding usually requires the use of steel mesh tin. If there is no steel mesh, the following methods can be used:
1. Manual tinning: Using the tin wire to manually apply the solder to the BGA pad, requires skill and experience, and the efficiency is low.
2. Spot the tin: Use the soldering iron to spot a little solder on the BGA pad, and then place the BGA on the PCB, and use the heat gun to heat the welding.
3. Solder paste: Use solder paste to coat the BGA pad with a thin layer of solder paste, then place the BGA on the PCB, and use a heat gun to heat the welding.
These methods require more time and labor, but can complete BGA welding.