There are significant differences between semiconductor discrete devices and integrated circuits in structure and manufacturing process.
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1. Structure: Semiconductor discrete devices are single components, consisting of one or several pn structures, which need to be packaged according to specific requirements. The integrated circuit is to integrate multiple components on a single chip, such as transistors, capacitors, resistors, etc., through metal wire connection to achieve the function of the circuit. Integrated circuits can be broadly divided into three categories, including semiconductor integrated circuits, hybrid integrated circuits and thin film integrated circuits, of which semiconductor integrated circuits can be divided into bipolar integrated circuits and metal-oxide-semiconductor integrated circuits.
2. Manufacturing process: The manufacturing of semiconductor discrete devices is relatively simple, and its manufacturing process mainly includes several steps such as mask preparation, diffusion, oxidation, and metallization. The manufacturing process of integrated circuits is very complex, and the basic process includes wafer processing, masking, etching, ion implantation, metallization, testing and other steps.
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In general, semiconductor discrete devices and integrated circuits have obvious differences in structure and manufacturing process. These differences make them have their own unique applications and functions in electronic devices.