The concept stocks in the semiconductor sector are:
Chip foundry: SMIC International (AH), Huahong Semiconductor (H shares), SAN 'an Optoelectronics (third generation compound semiconductor foundry);
Chip equipment: Chip Acer Micro installation (the first share of domestic lithography equipment), North China Chuang, Zhongwei Company, Changchuan Technology, precision measurement Electronics, to pure technology, Wanye Enterprise, chip source micro, Saiteng stock, Huafeng Measurement and control, Huaxing Yuanchang;
Chip materials: Zhongjing Technology, Husi Industry, Anji Technology, Huatai Gas, Nanda Optoelectronics, Jacques Technology, Rongda Photosensitive, Qingyi Optoelectronics, Dinglong Shares, Feikai Materials, Shanghai Xinyang, Greenda;
Wafer industry chain: Silanwei, Liangwei, China Resources Micro, Wentai Technology, Star Semiconductor, Xinjie Energy, Jiejie Micro, Yangjie Technology;
Sealed test: Changdian Technology, Tongfu Micro electricity, Huatian Technology, Jingfang Technology, Shentech (storage package), Liyang chip, Helin micro Na (test probe);
Power semiconductor: China Resources Micro, Star Semiconductor, SAN 'an Optoelectronics, Liang Micro, Jiejie Micro, Yangjie Technology, Taiji Shares, Shilanwei, Galaxy Micro;
Storage: Zhaoyi Innovation, Beijing Junzheng, Montage Technology;
Analog chips: SRIpu, Shengbang Shares, Jingfeng Mingyuan, Shengbang Shares, Zhongying Electronics, Zhuosheng Micro, Weil Shares, Xinhai Technology, Xinpeng Micro, Ming Microelectronics, Fuman Electronics;
MCU: Weil Stock, Wentai Technology, Zhaoyi Innovation, Huiting Technology, Beijing Junzheng, Shunluo Electronics, Core Sea Technology, National Technology;
IC design: Weil Co., LTD., JingfengMingyuan Co., LTD., Xinpeng Micro Co., LTD., Juchen Co., LTD.
IC carrier board: Shennan Circuit, Xingsen Technology, Chongda Technology;
Passive components \/MLCC: Shunluo Electronics, Jianghai Shares, Fenghua High-tech, Sanhuan Group, Jiemei Technology (passive components upstream paper carrier with dragon head);
LED chip: Jingfeng Mingyuan, Ming Microelectronics, Huacan Optoelectronics, dry light Optoelectronics, Jucan Optoelectronics, Fuman Electronics;
Copper clad plate: Shengyi Technology, Jin 'an Guoji, Hua Zheng New Material, South Asia New material;
HDI: Bomin Electronics, Zhongjing Electronics, Shenghong Technology, Dongshan Precision, Pengding Holdings.